PAUL BRIAN JAYNES

Person

MELBOURNE, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 11,657,989
- Issue date May 23, 2023
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 10,818,448
- Issue date Oct 27, 2020
- Harris Corporation
- Louis Joseph Rendek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 9,922,783
- Issue date Mar 20, 2018
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional liquid crystal polymer multilayer circuit board i...
- Patent number 9,117,602
- Issue date Aug 25, 2015
- Harris Corporation
- Louis Joseph Rendek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating non-planar circuit board
- Patent number 8,161,633
- Issue date Apr 24, 2012
- Harris Corporation
- Lawrence W. Shacklette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for sealing flex circuits made with an LCP sub...
- Patent number 7,768,619
- Issue date Aug 3, 2010
- Harris Corporation
- C. W. Sinjin Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for sealing flex circuits having heat sensitive circuit e...
- Patent number 7,591,924
- Issue date Sep 22, 2009
- Harris Corporation
- C. W. Sinjin Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of constructing a structural circuit
- Patent number 7,343,675
- Issue date Mar 18, 2008
- Harris Corporation
- C. W. Sinjin Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for sealing flex circuits having heat sensitiv...
- Patent number 7,128,801
- Issue date Oct 31, 2006
- Harris Corporation
- C. W. Sinjin Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20230238197
- Publication date Jul 27, 2023
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20210005405
- Publication date Jan 7, 2021
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20180166230
- Publication date Jun 14, 2018
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD I...
- Publication number 20150334851
- Publication date Nov 19, 2015
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD I...
- Publication number 20090185357
- Publication date Jul 23, 2009
- Harris Corporation
- Louis Joseph Rendek, JR.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-Planar Circuit Board and a Method for Fabricating the Same
- Publication number 20080244898
- Publication date Oct 9, 2008
- Harris Corporation
- Lawrence W. Shacklette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS HAVING HEAT SENSITIV...
- Publication number 20060286189
- Publication date Dec 21, 2006
- C.W. Sinjin Smith
- B32 - LAYERED PRODUCTS
Information Patent Application
Method and apparatus for sealing flex circuits having heat sensitiv...
- Publication number 20060169405
- Publication date Aug 3, 2006
- HARRIS CORPORATION
- C.W. Sinjin Smith
- B32 - LAYERED PRODUCTS
Information Patent Application
Multi-functional structural circuits
- Publication number 20060104037
- Publication date May 18, 2006
- Harris Corporation
- C.W. Sinjin Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for sealing flex circuits made with an LCP sub...
- Publication number 20060028612
- Publication date Feb 9, 2006
- HARRIS CORPORATION
- C.W. Sinjin Smith
- B30 - PRESSES

PAUL BRIAN JAYNES

Person

Patents Grantslast 30 patents

Method for making a three-dimensional liquid crystal polymer multil...

Method for making a three-dimensional liquid crystal polymer multil...

Method for making a three-dimensional liquid crystal polymer multil...

Three-dimensional liquid crystal polymer multilayer circuit board i...

Method of fabricating non-planar circuit board

Method and apparatus for sealing flex circuits made with an LCP sub...

Apparatus for sealing flex circuits having heat sensitive circuit e...

Method of constructing a structural circuit

Method and apparatus for sealing flex circuits having heat sensitiv...

Patents Applicationslast 30 patents

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD I...

THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD I...

Non-Planar Circuit Board and a Method for Fabricating the Same

METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS HAVING HEAT SENSITIV...

Method and apparatus for sealing flex circuits having heat sensitiv...

Multi-functional structural circuits

Method and apparatus for sealing flex circuits made with an LCP sub...