Paul C. Lindsey Jr.

Person

Lafayette, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Modified plasma dicing process to improve back metal cleaving
- Patent number 10,056,297
- Issue date Aug 21, 2018
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for separating devices from a semiconductor wafer
- Patent number 9,153,493
- Issue date Oct 6, 2015
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method using fluid pressure to remove back metal from semiconductor...
- Patent number 8,906,745
- Issue date Dec 9, 2014
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing back metal from an etched semiconductor scribe s...
- Patent number 8,450,188
- Issue date May 28, 2013
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a semiconductor wafer having semiconductor and m...
- Patent number 8,445,361
- Issue date May 21, 2013
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer scribing system
- Patent number 6,826,840
- Issue date Dec 7, 2004
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated circuit
- Patent number 6,022,807
- Issue date Feb 8, 2000
- Micro Processing Technology, Inc.
- Paul C. Lindsey
- B24 - GRINDING POLISHING
Information Patent Grant
Reactor apparatus for plasma etching or deposition
- Patent number 4,264,393
- Issue date Apr 28, 1981
- Motorola, Inc.
- Georges J. Gorin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Scribing tool and method
- Publication number 20060162172
- Publication date Jul 27, 2006
- MICRO PROCESSING TECHNOLOGY, INC.
- Paul C. Lindsey
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Application
Scribing system with particle remover
- Publication number 20060162173
- Publication date Jul 27, 2006
- MICRO PROCESSING TECHNOLOGY, INC.
- Paul C. Lindsey
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...

Paul C. Lindsey Jr.

Person

Patents Grantslast 30 patents

Modified plasma dicing process to improve back metal cleaving

System for separating devices from a semiconductor wafer

Method using fluid pressure to remove back metal from semiconductor...

Method of removing back metal from an etched semiconductor scribe s...

Method of dividing a semiconductor wafer having semiconductor and m...

Semiconductor wafer scribing system

Method for fabricating an integrated circuit

Reactor apparatus for plasma etching or deposition

Patents Applicationslast 30 patents

Scribing tool and method

Scribing system with particle remover