Paul C. Lindsey, Jr.

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Lafayette, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
System for breaking a semiconductor wafer or other workpiece along...
- Patent number 8,220,685
- Issue date Jul 17, 2012
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method and apparatus for improving force control in wafer scribing
- Patent number 7,807,479
- Issue date Oct 5, 2010
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribing system with particle remover
- Patent number 7,415,916
- Issue date Aug 26, 2008
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Scribing tool and method
- Patent number 7,392,732
- Issue date Jul 1, 2008
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Apparatus and method for scribing a semiconductor wafer while contr...
- Patent number 7,165,331
- Issue date Jan 23, 2007
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- H01 - BASIC ELECTRIC ELEMENTS