TREA

Paul D. Bantz

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  • Los Altos, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Advanced grounding scheme
    • Patent number 9,585,240
    • Issue date Feb 28, 2017
    • Qorvo US, Inc.
    • Thomas R. Landon
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thermal via structures with surface features
    • Patent number 8,908,383
    • Issue date Dec 9, 2014
    • TriQuint Semiconductor, Inc.
    • Tarak A. Railkar
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Sheet-molded chip-scale package
    • Patent number 8,487,435
    • Issue date Jul 16, 2013
    • TriQuint Semiconductor, Inc.
    • Frank J. Juskey
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    ADVANCED GROUNDING SCHEME
    • Publication number 20150116947
    • Publication date Apr 30, 2015
    • TriQuint Semiconductor, Inc.
    • Thomas R. Landon
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS
    • Publication number 20140106511
    • Publication date Apr 17, 2014
    • TriQuint Semiconductor, Inc.
    • Frank J. Juskey
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS
    • Publication number 20130234344
    • Publication date Sep 12, 2013
    • TriQuint Semiconductor, Inc.
    • Frank J. Juskey
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHEET-MOLDED CHIP-SCALE PACKAGE
    • Publication number 20120080768
    • Publication date Apr 5, 2012
    • TriQuint Semiconductor, Inc.
    • Frank J. Juskey
    • H01 - BASIC ELECTRIC ELEMENTS