Paul Danna

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Houston, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Dual-path high-speed interconnect PCB layout solution
- Patent number 12,068,554
- Issue date Aug 20, 2024
- Hewlett Packard Enterprise Development LP
- Paul Danna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband routing techniques for PCB layout
- Patent number 11,937,373
- Issue date Mar 19, 2024
- Hewlett Packard Enterprise Development LP
- Melvin K. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High connector count mating compliance
- Patent number 11,381,017
- Issue date Jul 5, 2022
- Hewlett Packard Enterprise Development LP
- John Franz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER VIA RESONANCE SUPPRESSION
- Publication number 20240098898
- Publication date Mar 21, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Melvin Kent Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIDEBAND ROUTING TECHNIQUES FOR PCB LAYOUT
- Publication number 20230292436
- Publication date Sep 14, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Melvin K. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-PATH HIGH-SPEED INTERCONNECT PCB LAYOUT SOLUTION
- Publication number 20230246353
- Publication date Aug 3, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Paul Danna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CONNECGOR COUNT MATING COMPLIANCE
- Publication number 20210320443
- Publication date Oct 14, 2021
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- John Franz
- H01 - BASIC ELECTRIC ELEMENTS