Paul DuFresne

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Langhorne, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Copper foil and copper clad laminates for fabrication of multi-laye...
- Patent number 6,372,113
- Issue date Apr 16, 2002
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Simplified process for production of roughened copper foil
- Patent number 6,270,645
- Issue date Aug 7, 2001
- Circuit Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for electrodeposition of barrier layer over copper foil bon...
- Patent number 6,224,991
- Issue date May 1, 2001
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper foil having a modified shiny side
- Patent number 5,989,727
- Issue date Nov 23, 1999
- Circuit Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for the manufacture of printed circuit boards and metho...
- Patent number 5,447,619
- Issue date Sep 5, 1995
- Circuit Foil USA, Inc.
- Adam M. Wolski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER FOIL AND COPPER CLAD LAMINATES FOR FABRICATION OF MULTI-LAYE...
- Publication number 20010051282
- Publication date Dec 13, 2001
- Yates Foil USA, Inc.
- CHARLES B. YATES
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR