Paul Evans Bakeman Jr.

Person

Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,946,912
- Issue date Feb 3, 2015
- Intersil Americas LLC
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,652,960
- Issue date Feb 18, 2014
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,569,896
- Issue date Oct 29, 2013
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for controlling the relative size of images forme...
- Patent number 5,952,160
- Issue date Sep 14, 1999
- International Business Machines Corporation
- Paul Evans Bakeman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multichip semiconductor structures with consolidated circuitry and...
- Patent number 5,943,254
- Issue date Aug 24, 1999
- International Business Machines Corporation
- Paul Evans Bakeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor structures with interchip electrostatic dis...
- Patent number 5,930,098
- Issue date Jul 27, 1999
- International Business Machines Corporation
- Steven Howard Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for controlling the relative size of images forme...
- Patent number 5,764,342
- Issue date Jun 9, 1998
- International Business Machines Corporation
- Paul Evans Bakeman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Protection of aluminum metallization against chemical attack during...
- Patent number 5,731,246
- Issue date Mar 24, 1998
- International Business Machines Corporation
- Paul Evans Bakeman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multichip semiconductor structures with interchip electrostatic dis...
- Patent number 5,703,747
- Issue date Dec 30, 1997
- Steven Howard Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for controlling the relative size of images forme...
- Patent number 5,635,285
- Issue date Jun 3, 1997
- International Business Machines Corporation
- Paul E. Bakeman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of making corrugated vertical stack capacitor (CVSTC)
- Patent number 5,556,802
- Issue date Sep 17, 1996
- International Business Machines Corporation
- Paul E. Bakeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of aluminum metallization against chemical attack during...
- Patent number 5,480,748
- Issue date Jan 2, 1996
- International Business Machines Corporation
- Paul E. Bakeman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Short channel transistors
- Patent number 5,347,153
- Issue date Sep 13, 1994
- International Business Machines Corporation
- Paul E. Bakeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emissivity independent temperature measurement systems
- Patent number 5,226,732
- Issue date Jul 13, 1993
- International Business Machines Corporation
- James S. Nakos
- G01 - MEASURING TESTING
Information Patent Grant
CMOS contacting structure having degeneratively doped regions for t...
- Patent number 4,622,573
- Issue date Nov 11, 1986
- International Business Machines Corporation
- Paul E. Bakeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing the radiation resistance of charge storage se...
- Patent number 4,506,436
- Issue date Mar 26, 1985
- International Business Machines Corporation
- Paul E. Bakeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming IGFET devices having improved drain voltage char...
- Patent number 4,369,072
- Issue date Jan 18, 1983
- International Business Machines Corp.
- Paul E. Bakeman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20140113444
- Publication date Apr 24, 2014
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20130130445
- Publication date May 23, 2013
- INTERSIL AMERICAS INC.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20070187837
- Publication date Aug 16, 2007
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for thermally processing undoped and lightly...
- Publication number 20070072400
- Publication date Mar 29, 2007
- Paul E. Bakeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active area bonding compatible high current structures
- Publication number 20060099823
- Publication date May 11, 2006
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active area bonding compatible high current structures
- Publication number 20050042853
- Publication date Feb 24, 2005
- INTERSIL AMERICAS INC.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS

Paul Evans Bakeman Jr.

Person

Patents Grantslast 30 patents

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Method and system for controlling the relative size of images forme...

Multichip semiconductor structures with consolidated circuitry and...

Multichip semiconductor structures with interchip electrostatic dis...

Method and system for controlling the relative size of images forme...

Protection of aluminum metallization against chemical attack during...

Multichip semiconductor structures with interchip electrostatic dis...

Method and system for controlling the relative size of images forme...

Method of making corrugated vertical stack capacitor (CVSTC)

Protection of aluminum metallization against chemical attack during...

Short channel transistors

Emissivity independent temperature measurement systems

CMOS contacting structure having degeneratively doped regions for t...

Method for increasing the radiation resistance of charge storage se...

Method for forming IGFET devices having improved drain voltage char...

Patents Applicationslast 30 patents

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Apparatus and methods for thermally processing undoped and lightly...

Active area bonding compatible high current structures

Active area bonding compatible high current structures