Paul F. Smith

Person

Campbell, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reliability barrier integration for Cu application
- Patent number 7,026,238
- Issue date Apr 11, 2006
- Applied Materials, Inc.
- Ming Xi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of conditioning electrochemical baths in plating technology
- Patent number 6,893,548
- Issue date May 17, 2005
- Applied Materials Inc.
- Robin Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post metal barrier/adhesion film
- Patent number 6,753,248
- Issue date Jun 22, 2004
- Applied Materials, Inc.
- Michael Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF powered plasma enhanced chemical vapor deposition reactor and me...
- Patent number 6,705,246
- Issue date Mar 16, 2004
- Micron Technology, Inc.
- Sujit Sharan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF powered plasma enhanced chemical vapor deposition reactor and me...
- Patent number 6,533,894
- Issue date Mar 18, 2003
- Micron Technology, Inc.
- Sujit Sharan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF powered plasma enhanced chemical vapor deposition reactor and me...
- Patent number 6,395,128
- Issue date May 28, 2002
- Micron Technology, Inc.
- Sujit Sharan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heater for processing chamber
- Patent number 6,350,320
- Issue date Feb 26, 2002
- Applied Materials, Inc.
- Semyon Sherstinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ electroless copper seed layer enhancement in an electroplat...
- Patent number 6,258,223
- Issue date Jul 10, 2001
- Applied Materials, Inc.
- Robin Cheung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
RF powered plasma enhanced chemical vapor deposition reactor and me...
- Patent number 6,235,646
- Issue date May 22, 2001
- Micron Technology, Inc.
- Sujit Sharan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF powered plasma enhanced chemical vapor deposition reactor and me...
- Patent number 6,227,141
- Issue date May 8, 2001
- Micron Technology, Inc.
- Sujit Sharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF powered plasma enhanced chemical vapor deposition reactor and me...
- Patent number 6,159,867
- Issue date Dec 12, 2000
- Micron Technology, Inc.
- Sujit Sharan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF powered plasma enhanced chemical vapor deposition reactor and me...
- Patent number 6,112,697
- Issue date Sep 5, 2000
- Micron Technology, Inc.
- Sujit Sharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a cleaning process in a high temperature,...
- Patent number 5,983,906
- Issue date Nov 16, 1999
- Applied Materials, Inc.
- Jun Zhao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Edge barrier of polysilicon and metal for integrated circuit chips
- Patent number 4,364,078
- Issue date Dec 14, 1982
- Synertek
- Paul W. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EXTERNAL PLASMA SYSTEM
- Publication number 20180130639
- Publication date May 10, 2018
- Michael Nicholas Vranich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA SOURCE FOR CHAMBER CLEANING AND PROCESS
- Publication number 20100098882
- Publication date Apr 22, 2010
- Applied Materials, Inc.
- Dmitry Lubomirsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RELIABILITY BARRIER INTEGRATION FOR CU APPLICATION
- Publication number 20070151861
- Publication date Jul 5, 2007
- Ming Xi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reliability barrier integration for Cu application
- Publication number 20040209460
- Publication date Oct 21, 2004
- Ming Xi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20030116427
- Publication date Jun 26, 2003
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF powered plasma enhanced chemical vapor deposition reactor and me...
- Publication number 20020061656
- Publication date May 23, 2002
- Sujit Sharan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reliability barrier integration for Cu application
- Publication number 20020060363
- Publication date May 23, 2002
- APPLIED MATERIALS, INC.
- Ming Xi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RF powered plasma enhanced chemical vapor deposition reactor and me...
- Publication number 20020056416
- Publication date May 16, 2002
- Sujit Sharan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for conditioning electrochemical baths in plat...
- Publication number 20020033340
- Publication date Mar 21, 2002
- Robin Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF POWERED PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION REACTOR AND ME...
- Publication number 20010003270
- Publication date Jun 14, 2001
- SUJIT SHARAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Paul F. Smith

Person

Patents Grantslast 30 patents

Reliability barrier integration for Cu application

Method of conditioning electrochemical baths in plating technology

Post metal barrier/adhesion film

RF powered plasma enhanced chemical vapor deposition reactor and me...

RF powered plasma enhanced chemical vapor deposition reactor and me...

RF powered plasma enhanced chemical vapor deposition reactor and me...

Heater for processing chamber

In-situ electroless copper seed layer enhancement in an electroplat...

RF powered plasma enhanced chemical vapor deposition reactor and me...

RF powered plasma enhanced chemical vapor deposition reactor and me...

RF powered plasma enhanced chemical vapor deposition reactor and me...

RF powered plasma enhanced chemical vapor deposition reactor and me...

Methods and apparatus for a cleaning process in a high temperature,...

Edge barrier of polysilicon and metal for integrated circuit chips

Patents Applicationslast 30 patents

EXTERNAL PLASMA SYSTEM

PLASMA SOURCE FOR CHAMBER CLEANING AND PROCESS

RELIABILITY BARRIER INTEGRATION FOR CU APPLICATION

Reliability barrier integration for Cu application

Self-ionized and inductively-coupled plasma for sputtering and resp...

RF powered plasma enhanced chemical vapor deposition reactor and me...

Reliability barrier integration for Cu application

RF powered plasma enhanced chemical vapor deposition reactor and me...

Method and apparatus for conditioning electrochemical baths in plat...

RF POWERED PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION REACTOR AND ME...