Paul G. Perez

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Baguio City, PH

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Patents Grantslast 30 patents

Information Patent Grant
Method and system of wire bonding using interposer pads
- Patent number 6,908,843
- Issue date Jun 21, 2005
- Texas Instruments Incorporated
- Herald M. Baldonado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array substrate with improved traces formed from copper b...
- Patent number 6,552,430
- Issue date Apr 22, 2003
- Texas Instruments Incorporated
- Paul Gabriel D. Perez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and system of wire bonding using interposer pads
- Publication number 20030122265
- Publication date Jul 3, 2003
- Herald M. Baldonado
- H01 - BASIC ELECTRIC ELEMENTS