Paul GONDCHARTON

Person

Grenoble, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for adhering a first structure and a second structure
- Patent number 10,710,192
- Issue date Jul 14, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Bruno Imbert
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling two substrates of different natures via a duc...
- Patent number 10,679,963
- Issue date Jun 9, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Bruno Imbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-metal direct bonding method
- Patent number 10,483,111
- Issue date Nov 19, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct bonding method
- Patent number 10,403,597
- Issue date Sep 3, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for direct adhesion via low-roughness metal layers
- Patent number 10,115,698
- Issue date Oct 30, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for obtaining a bonding surface for direct bonding
- Patent number 10,032,742
- Issue date Jul 24, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lamine Benaissa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a structure by assembling at least two elemen...
- Patent number 9,922,953
- Issue date Mar 20, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a semiconductor structure with temporary...
- Patent number 9,735,038
- Issue date Aug 15, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for carrying out a conductive direct metal bonding
- Patent number 9,472,530
- Issue date Oct 18, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ADHERING A FIRST STRUCTURE AND A SECOND STRUCTURE
- Publication number 20180297143
- Publication date Oct 18, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Bruno IMBERT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT BONDING METHOD
- Publication number 20180218999
- Publication date Aug 2, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METAL-METAL DIRECT BONDING METHOD
- Publication number 20180019124
- Publication date Jan 18, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DIRECT ADHESION VIA LOW-ROUGHNESS METAL LAYERS
- Publication number 20170236800
- Publication date Aug 17, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN LAYER PASSIVATION PROCESS AND DIRECT BONDING PROCESS
- Publication number 20170213807
- Publication date Jul 27, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Lamine BENAISSA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...
- Publication number 20170025377
- Publication date Jan 26, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE WITH TEMPORARY...
- Publication number 20160189995
- Publication date Jun 30, 2016
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING TWO SUBSTRATES OF DIFFERENT NATURES VIA A DUC...
- Publication number 20160126215
- Publication date May 5, 2016
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Bruno IMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CARRYING OUT A CONDUCTIVE DIRECT METAL BONDING
- Publication number 20150380383
- Publication date Dec 31, 2015
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR OBTAINING A BONDING SURFACE FOR DIRECT BONDING
- Publication number 20150364442
- Publication date Dec 17, 2015
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Lamine BENAISSA
- H01 - BASIC ELECTRIC ELEMENTS

Paul GONDCHARTON

Person

Patents Grantslast 30 patents

Method for adhering a first structure and a second structure

Method for assembling two substrates of different natures via a duc...

Metal-metal direct bonding method

Direct bonding method

Method for direct adhesion via low-roughness metal layers

Method for obtaining a bonding surface for direct bonding

Process for producing a structure by assembling at least two elemen...

Process for manufacturing a semiconductor structure with temporary...

Method for carrying out a conductive direct metal bonding

Patents Applicationslast 30 patents

METHOD FOR ADHERING A FIRST STRUCTURE AND A SECOND STRUCTURE

DIRECT BONDING METHOD

METAL-METAL DIRECT BONDING METHOD

METHOD FOR DIRECT ADHESION VIA LOW-ROUGHNESS METAL LAYERS

TUNGSTEN LAYER PASSIVATION PROCESS AND DIRECT BONDING PROCESS

PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...

PROCESS FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE WITH TEMPORARY...

METHOD FOR ASSEMBLING TWO SUBSTRATES OF DIFFERENT NATURES VIA A DUC...

METHOD FOR CARRYING OUT A CONDUCTIVE DIRECT METAL BONDING

METHOD FOR OBTAINING A BONDING SURFACE FOR DIRECT BONDING