Paul H. Palmateer

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming an adherent layer of metallurgy on a ceramic subs...
- Patent number 5,167,913
- Issue date Dec 1, 1992
- International Business Machines Corporation
- John Acocella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of tapered head pin design to improve the stress distribution i...
- Patent number 4,970,570
- Issue date Nov 13, 1990
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing and stress relief layers and use thereof
- Patent number 4,880,684
- Issue date Nov 14, 1989
- International Business Machines Corporation
- David W. Boss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for braze attachment of electronic package members
- Patent number 4,824,009
- Issue date Apr 25, 1989
- International Business Machines Corporation
- Raj N. Master
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of pure metal films to ceramics
- Patent number 4,764,341
- Issue date Aug 16, 1988
- International Business Machines Corporation
- Philip L. Flaitz
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
High melting point copper-gold-tin brazing alloy for chip carriers
- Patent number 4,634,638
- Issue date Jan 6, 1987
- International Business Machines Corporation
- Norman G. Ainslie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High melting point process for Au:Sn:80:20 brazing alloy for chip c...
- Patent number 4,418,857
- Issue date Dec 6, 1983
- International Business Machines Corp.
- Norman G. Ainslie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Paul H. Palmateer

Person

Patents Grantslast 30 patents

Method of forming an adherent layer of metallurgy on a ceramic subs...

Use of tapered head pin design to improve the stress distribution i...

Sealing and stress relief layers and use thereof

Process for braze attachment of electronic package members

Bonding of pure metal films to ceramics

High melting point copper-gold-tin brazing alloy for chip carriers

High melting point process for Au:Sn:80:20 brazing alloy for chip c...