Paul H. Wermer

Person

San Francisco, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic assemblies comprising ceramic/organic hybrid substrate w...
- Patent number 7,535,728
- Issue date May 19, 2009
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with organic dielectric layer
- Patent number 7,348,496
- Issue date Mar 25, 2008
- Intel Corporation
- Paul H. Wermer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless electronics packaging and methods of manufacture
- Patent number 7,159,313
- Issue date Jan 9, 2007
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymeric dielectric material for high-energy density capacitors
- Patent number 7,136,275
- Issue date Nov 14, 2006
- Intel Corporation
- Paul A. Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data processing system comprising ceramic/organic hybrid substrate...
- Patent number 7,120,031
- Issue date Oct 10, 2006
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating microelectronic package having a bumpless lam...
- Patent number 7,067,356
- Issue date Jun 27, 2006
- Intel Corporation
- Steven Towle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless electronics packaging
- Patent number 6,840,777
- Issue date Jan 11, 2005
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor
- Patent number 6,829,133
- Issue date Dec 7, 2004
- Intel Corporation
- Paul H. Wermer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly comprising ceramic/organic hybrid substrate wit...
- Patent number 6,775,150
- Issue date Aug 10, 2004
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrocoating process to form a dielectric layer in an organic sub...
- Patent number 6,605,551
- Issue date Aug 12, 2003
- Intel Corporation
- Paul H. Wermer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package having a bumpless laminated interconnection...
- Patent number 6,555,906
- Issue date Apr 29, 2003
- Intel Corporation
- Steven Towle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymeric dielectric material for high-energy density capacitors
- Patent number 6,480,370
- Issue date Nov 12, 2002
- Intel Corporation
- Paul A. Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLIES COMPRISING CERAMIC/ORGANIC HYBRID SUBSTRATE W...
- Publication number 20060279940
- Publication date Dec 14, 2006
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrocoating process to form a dielectric layer in an organic sub...
- Publication number 20050099762
- Publication date May 12, 2005
- Intel Corporation
- Paul H. Wermer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solderless electronics packaging and methods of manufacture
- Publication number 20050091844
- Publication date May 5, 2005
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly comprising ceramic/organic hybrid substrate wit...
- Publication number 20040238942
- Publication date Dec 2, 2004
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic package having a bumpless laminated interconnection...
- Publication number 20030227077
- Publication date Dec 11, 2003
- Intel Corporation
- Steven Towle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrocoating process to form a dielectric layer in an organic sub...
- Publication number 20030205406
- Publication date Nov 6, 2003
- Intel Corporation
- Paul H. Wermer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polymeric dielectric material for high-energy density capacitors
- Publication number 20030011960
- Publication date Jan 16, 2003
- Intel Corporation
- Paul A. Koning
- B82 - NANO-TECHNOLOGY
Information Patent Application
Electrocoating process to form a dielectric layer in an organic sub...
- Publication number 20020105774
- Publication date Aug 8, 2002
- Intel Corporation
- Paul H. Wermer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic package having a bumpless laminated interconnection...
- Publication number 20020074641
- Publication date Jun 20, 2002
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless electronics packaging and methods of manufacture
- Publication number 20020065965
- Publication date May 30, 2002
- Intel Corporation
- Ajit V. Sathe
- H01 - BASIC ELECTRIC ELEMENTS

Paul H. Wermer

Person

Patents Grantslast 30 patents

Electronic assemblies comprising ceramic/organic hybrid substrate w...

Circuit board with organic dielectric layer

Solderless electronics packaging and methods of manufacture

Polymeric dielectric material for high-energy density capacitors

Data processing system comprising ceramic/organic hybrid substrate...

Method of fabricating microelectronic package having a bumpless lam...

Solderless electronics packaging

Capacitor

Electronic assembly comprising ceramic/organic hybrid substrate wit...

Electrocoating process to form a dielectric layer in an organic sub...

Microelectronic package having a bumpless laminated interconnection...

Polymeric dielectric material for high-energy density capacitors

Patents Applicationslast 30 patents

ELECTRONIC ASSEMBLIES COMPRISING CERAMIC/ORGANIC HYBRID SUBSTRATE W...

Electrocoating process to form a dielectric layer in an organic sub...

Solderless electronics packaging and methods of manufacture

Electronic assembly comprising ceramic/organic hybrid substrate wit...

Microelectronic package having a bumpless laminated interconnection...

Electrocoating process to form a dielectric layer in an organic sub...

Polymeric dielectric material for high-energy density capacitors

Electrocoating process to form a dielectric layer in an organic sub...

Microelectronic package having a bumpless laminated interconnection...

Solderless electronics packaging and methods of manufacture