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Paul Higgins
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Harriman, NY, US
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last 30 patents
Information
Patent Grant
Technique to create a buried plate in embedded dynamic random acces...
Patent number
8,563,446
Issue date
Oct 22, 2013
International Business Machines Corporation
Ashima B. Chakravarti
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Technique to create a buried plate in embedded dynamic random acces...
Patent number
8,236,710
Issue date
Aug 7, 2012
International Business Machines Corporation
Ashima B. Chakravarti
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Formation of ultra-thin oxide layers by self-limiting interfacial o...
Patent number
7,235,440
Issue date
Jun 26, 2007
Tokyo Electron Limited
David L O'Meara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming uniform ultra-thin oxynitride layers
Patent number
7,202,186
Issue date
Apr 10, 2007
Tokyo Electron Limited
David L O'Meara
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
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Patent Application
TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...
Publication number
20120228736
Publication date
Sep 13, 2012
International Business Machines Corporation
ASHIMA B. CHAKRAVARTI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...
Publication number
20120086103
Publication date
Apr 12, 2012
International Business Machines Corporation
ASHIMA B. CHAKRAVARTI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Formation of ultra-thin oxide layers by self-limiting interfacial o...
Publication number
20050026453
Publication date
Feb 3, 2005
TOKYO ELECTRON LIMITED
David L. O'Meara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming uniform ultra-thin oxynitride layers
Publication number
20050026459
Publication date
Feb 3, 2005
TOKYO ELECTRON LIMITED
David L. O'Meara
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...