Paul J. Brown

Person

Wakefield, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Array type discrete decoupling under BGA grid
- Patent number 10,743,408
- Issue date Aug 11, 2020
- ALCATEL LUCENT
- James M. Schriel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete component carrier
- Patent number 10,667,399
- Issue date May 26, 2020
- Nokia Solutions and Networks Oy
- Alex Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spatial location of vias in a printed circuit board
- Patent number 10,650,181
- Issue date May 12, 2020
- Nokia Solutions and Networks Oy
- Paul J. Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Side clamping BGA socket
- Patent number 10,257,952
- Issue date Apr 9, 2019
- Alcatel Lucent
- Paul J. Brown
- G01 - MEASURING TESTING
Information Patent Grant
Side clamping BGA socket
- Patent number 9,832,899
- Issue date Nov 28, 2017
- ALCATEL LUCENT
- Paul J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relieved component pad for 0201 use between vias
- Patent number 9,769,925
- Issue date Sep 19, 2017
- Alcatel Lucent
- Alex L. Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
0204 shifted vias with merge pads
- Patent number 9,635,760
- Issue date Apr 25, 2017
- Alcatel-Lucent USA Inc.
- Alex L. Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backdrill reliability anchors
- Patent number 9,560,742
- Issue date Jan 31, 2017
- Alcatel Lucent
- Paul J. Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal warp compensation IC package
- Patent number 8,912,449
- Issue date Dec 16, 2014
- Alcatel Lucent
- Paul James Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
De-pop on-device decoupling for BGA
- Patent number 8,863,071
- Issue date Oct 14, 2014
- Alcatel Lucent
- Alex Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-grid on-device decoupling for BGA
- Patent number 8,806,420
- Issue date Aug 12, 2014
- Alcatel Lucent
- Alex Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land pattern for 0201 components on a 0.8 mm pitch array
- Patent number 8,759,689
- Issue date Jun 24, 2014
- Alcatel Lucent
- Alex Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable IC package stiffening brace and method
- Patent number 8,559,180
- Issue date Oct 15, 2013
- Alcatel Lucent
- Paul J. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Warp reactive IC package
- Patent number 8,389,864
- Issue date Mar 5, 2013
- Alcatel Lucent
- Paul James Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared via decoupling for area arrays components
- Patent number 7,738,259
- Issue date Jun 15, 2010
- Alcatel Lucent
- Alex L. Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alternating micro-vias and throughboard vias to create PCB routing...
- Patent number 7,714,234
- Issue date May 11, 2010
- Alcatel Lucent
- Paul James Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Emergency alert system enhancement using alert server and metro ATM...
- Patent number 7,697,558
- Issue date Apr 13, 2010
- Alcatel Lucent
- Mark Christopher Pilon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board thickness adaptors
- Patent number 7,663,888
- Issue date Feb 16, 2010
- Alcatel Lucent
- Simon Paul Creasy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-grid decoupling for ball grid array (BGA) devices
- Patent number 7,602,615
- Issue date Oct 13, 2009
- Alcatel Lucent
- Alex Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using rows/columns of micro-vias to create PCB routing channels in...
- Patent number 7,368,667
- Issue date May 6, 2008
- Alcatel
- Paul James Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alternating micro-vias and throughboard vias to create PCB routing...
- Patent number 7,365,435
- Issue date Apr 29, 2008
- Alcatel
- Paul James Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Area array routing masks for improved escape of devices on PCB
- Patent number 7,343,577
- Issue date Mar 11, 2008
- Alcatel
- Paul James Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Off-width pitch for improved circuit card routing
- Patent number 7,269,813
- Issue date Sep 11, 2007
- Alcatel
- Paul Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tailored interconnect module
- Patent number 6,908,314
- Issue date Jun 21, 2005
- Alcatel
- Paul Brown
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLATED VIA-IN-VIA VERTICAL CONNECTION
- Publication number 20250031318
- Publication date Jan 23, 2025
- Nokia Solutions and Networks Oy
- Paul BROWN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-ASSEMBLY WARPAGE PAIRING
- Publication number 20240381603
- Publication date Nov 14, 2024
- Nokia Solutions and Networks Oy
- Paul Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONFIGURABLE WARPAGE CONTROL SPACERS
- Publication number 20240347432
- Publication date Oct 17, 2024
- Nokia Solutions and Networks Oy
- Alex Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD EDGE ELECTRICAL CONTACT STRUCTURES
- Publication number 20230232533
- Publication date Jul 20, 2023
- Nokia Solutions and Networks Oy
- David NORTH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER TRENCH
- Publication number 20230132123
- Publication date Apr 27, 2023
- Paul Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCRETE COMPONENT CARRIER
- Publication number 20200170116
- Publication date May 28, 2020
- Nokia Solutions and Networks Oy
- Alex CHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPATIAL LOCATION OF VIAS IN A PRINTED CIRCUIT BOARD
- Publication number 20190087524
- Publication date Mar 21, 2019
- Nokia Solutions and Networks Oy
- Paul J. BROWN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARRAY TYPE DISCRETE DECOUPLING UNDER BGA GRID
- Publication number 20180242447
- Publication date Aug 23, 2018
- ALCATEL-LUCENT CANADA INC.
- James M. SCHRIEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ORTHOGONAL ROUTING ON A PRINTED CIRCUIT BOARD
- Publication number 20180165401
- Publication date Jun 14, 2018
- Alcatel-Lucent Canada, Inc.
- Paul J. BROWN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIDE CLAMPING BGA SOCKET
- Publication number 20180098447
- Publication date Apr 5, 2018
- Alcatel-Lucent Canada Inc.
- Paul J. BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAVITY FORCE COMPENSATION PLATE FOR UPSIDE DOWN BALL GRID ARRAY
- Publication number 20180082868
- Publication date Mar 22, 2018
- Alcatel-Lucent Canada Inc.
- Paul J. BROWN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDERLYING RECESSED COMPONENT PLACEMENT
- Publication number 20180020547
- Publication date Jan 18, 2018
- ALCATEL-LUCENT CANADA INC.
- Alex L. CHAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARRAY TYPE DISCRETE DECOUPLING UNDER BGA GRID
- Publication number 20170367180
- Publication date Dec 21, 2017
- Alcatel-Lucent Canada, Inc.
- James M. SCHRIEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTENDED PADS TO EASE REWORK FOR BTC AND BGA TYPE TECHNOLOGY
- Publication number 20170280569
- Publication date Sep 28, 2017
- Alcatel-Lucent Canada, Inc.
- James M. SCHRIEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RELIEVED COMPONENT PAD FOR 0201 USE BETWEEN VIAS
- Publication number 20170142831
- Publication date May 18, 2017
- Alcatel-Lucent Canada, Inc.
- Alex L. Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKDRILL RELIABILITY ANCHORS
- Publication number 20160135288
- Publication date May 12, 2016
- Alcatel-Lucent Canada, Inc.
- PAUL J. BROWN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOUNTING SOLUTION FOR COMPONENTS ON A VERY FINE PITCH ARRAY
- Publication number 20150092373
- Publication date Apr 2, 2015
- ALCATEL-LUCENT CANADA INC.
- Alex CHAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DE-POP ON-DEVICE DECOUPLING FOR BGA
- Publication number 20150001716
- Publication date Jan 1, 2015
- ALCATEL-LUCENT CANADA, INC.
- Alex Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL WARP COMPENSATION IC PACKAGE
- Publication number 20130113067
- Publication date May 9, 2013
- Alcatel-Lucent Canada Inc.
- Paul James BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-GRID ON-DEVICE DECOUPLING FOR BGA
- Publication number 20130062762
- Publication date Mar 14, 2013
- ALCATEL-LUCENT CANADA, INC.
- Alex Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DE-POP ON-DEVICE DECOUPLING FOR BGA
- Publication number 20130062763
- Publication date Mar 14, 2013
- ALCATEL-LUCENT CANADA, INC.
- Alex CHAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
0201 LAND PATTERN FOR 1.0 mm AND .08 mm PITCH ARRAYS
- Publication number 20120168216
- Publication date Jul 5, 2012
- ALCATEL-LUCENT CANADA INC.
- Alex Chan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THERMAL WARP COMPENSATION IC PACKAGE
- Publication number 20120081872
- Publication date Apr 5, 2012
- ALCATEL-LUCENT CANADA INC.
- Paul James BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARP REACTIVE IC PACKAGE
- Publication number 20120081871
- Publication date Apr 5, 2012
- ALCATEL-LUCENT CANADA INC.
- Paul James Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE STIFFENER WITH BEAM
- Publication number 20110235304
- Publication date Sep 29, 2011
- ALCATEL-LUCENT CANADA, INC.
- Paul J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE IC PACKAGE STIFFENING BRACE AND METHOD
- Publication number 20110235283
- Publication date Sep 29, 2011
- ALCATEL-LUCENT CANADA, INC.
- Paul J. Brown
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Alternating micro-vias and throughboard vias to create PCB routing...
- Publication number 20080225502
- Publication date Sep 18, 2008
- ALCATEL
- Paul James Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Emergency alert system enhancement using alert server and metro ATM...
- Publication number 20080225848
- Publication date Sep 18, 2008
- ALCATEL LUCENT
- Mark Christopher Pilon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
In-grid decoupling for ball grid array (BGA) devices
- Publication number 20080205011
- Publication date Aug 28, 2008
- Alex Chan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board thickness adaptors
- Publication number 20080013290
- Publication date Jan 17, 2008
- ALCATEL
- Simon Paul Creasy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Paul J. Brown

Person

Patents Grantslast 30 patents

Array type discrete decoupling under BGA grid

Discrete component carrier

Spatial location of vias in a printed circuit board

Side clamping BGA socket

Side clamping BGA socket

Relieved component pad for 0201 use between vias

0204 shifted vias with merge pads

Backdrill reliability anchors

Thermal warp compensation IC package

De-pop on-device decoupling for BGA

In-grid on-device decoupling for BGA

Land pattern for 0201 components on a 0.8 mm pitch array

Removable IC package stiffening brace and method

Warp reactive IC package

Shared via decoupling for area arrays components

Alternating micro-vias and throughboard vias to create PCB routing...

Emergency alert system enhancement using alert server and metro ATM...

Printed circuit board thickness adaptors

In-grid decoupling for ball grid array (BGA) devices

Using rows/columns of micro-vias to create PCB routing channels in...

Alternating micro-vias and throughboard vias to create PCB routing...

Area array routing masks for improved escape of devices on PCB

Off-width pitch for improved circuit card routing

Tailored interconnect module

Patents Applicationslast 30 patents

PLATED VIA-IN-VIA VERTICAL CONNECTION

PRE-ASSEMBLY WARPAGE PAIRING

CONFIGURABLE WARPAGE CONTROL SPACERS

BOARD EDGE ELECTRICAL CONTACT STRUCTURES

SOLDER TRENCH

DISCRETE COMPONENT CARRIER

SPATIAL LOCATION OF VIAS IN A PRINTED CIRCUIT BOARD

ARRAY TYPE DISCRETE DECOUPLING UNDER BGA GRID

NON-ORTHOGONAL ROUTING ON A PRINTED CIRCUIT BOARD

SIDE CLAMPING BGA SOCKET

GRAVITY FORCE COMPENSATION PLATE FOR UPSIDE DOWN BALL GRID ARRAY

UNDERLYING RECESSED COMPONENT PLACEMENT

ARRAY TYPE DISCRETE DECOUPLING UNDER BGA GRID

EXTENDED PADS TO EASE REWORK FOR BTC AND BGA TYPE TECHNOLOGY

RELIEVED COMPONENT PAD FOR 0201 USE BETWEEN VIAS

BACKDRILL RELIABILITY ANCHORS

MOUNTING SOLUTION FOR COMPONENTS ON A VERY FINE PITCH ARRAY

DE-POP ON-DEVICE DECOUPLING FOR BGA

THERMAL WARP COMPENSATION IC PACKAGE

IN-GRID ON-DEVICE DECOUPLING FOR BGA

DE-POP ON-DEVICE DECOUPLING FOR BGA

0201 LAND PATTERN FOR 1.0 mm AND .08 mm PITCH ARRAYS

THERMAL WARP COMPENSATION IC PACKAGE

WARP REACTIVE IC PACKAGE

IC PACKAGE STIFFENER WITH BEAM

REMOVABLE IC PACKAGE STIFFENING BRACE AND METHOD

Alternating micro-vias and throughboard vias to create PCB routing...

Emergency alert system enhancement using alert server and metro ATM...

In-grid decoupling for ball grid array (BGA) devices

Printed circuit board thickness adaptors