Paul J. Diglio

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit die packages including a contiguous heat spreader
- Patent number 12,136,577
- Issue date Nov 5, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additively manufactured structures for heat dissipation from integr...
- Patent number 12,080,620
- Issue date Sep 3, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum modulated two phase cooling loop efficiency and parallelism...
- Patent number 12,057,370
- Issue date Aug 6, 2024
- Intel Corporation
- Paul Diglio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced silicon back end layers for improved thermal per...
- Patent number 12,021,016
- Issue date Jun 25, 2024
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and apparatus having a seal member for sealing of a device u...
- Patent number 12,000,487
- Issue date Jun 4, 2024
- Intel Corporation
- Paul Diglio
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Vacuum modulated two phase cooling loop performance enhancement
- Patent number 11,976,671
- Issue date May 7, 2024
- Intel Corporation
- Paul Diglio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and device for fast, passive alignment in photonics assembly
- Patent number 11,808,988
- Issue date Nov 7, 2023
- Intel Corporation
- Vineeth Abraham
- G02 - OPTICS
Information Patent Grant
Method and system for attaching optical fibers to warped photonic c...
- Patent number 11,762,157
- Issue date Sep 19, 2023
- Intel Corporation
- Sufi Ahmed
- G02 - OPTICS
Information Patent Grant
Low-profile gimbal platform for high-resolution in situ co-planarit...
- Patent number 11,674,980
- Issue date Jun 13, 2023
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Double-beam test probe
- Patent number 11,543,454
- Issue date Jan 3, 2023
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Electrical testing apparatus with lateral movement of a probe suppo...
- Patent number 11,073,538
- Issue date Jul 27, 2021
- Intel Corporation
- Paul Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Low-profile gimbal platform for high-resolution in situ co-planarit...
- Patent number 10,775,414
- Issue date Sep 15, 2020
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Thermal head with a thermal barrier for integrated circuit die proc...
- Patent number 10,499,461
- Issue date Dec 3, 2019
- Intel Corporation
- Mohit Mamodia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for measuring surface temperature
- Patent number 10,393,592
- Issue date Aug 27, 2019
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Fluid flow channel for enhanced heat transfer efficiency
- Patent number 10,030,916
- Issue date Jul 24, 2018
- Intel Corporation
- Phi Hung Thanh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Compliant thermal contact device and method
- Patent number 9,791,501
- Issue date Oct 17, 2017
- Intel Corporation
- Paul Diglio
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Placing integrated circuit devices using perturbation
- Patent number 9,638,747
- Issue date May 2, 2017
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Thermal interface material handling for thermal control of an elect...
- Patent number 9,377,486
- Issue date Jun 28, 2016
- Intel Corporation
- David Won-jun Song
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO REDUCE LEAKAGE OF COOLING FLUID USED TO CO...
- Publication number 20240328512
- Publication date Oct 3, 2024
- Intel Corporation
- Craig Yost
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT
- Publication number 20240175917
- Publication date May 30, 2024
- Intel Corporation
- Ruben NUNEZ BLANCO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY
- Publication number 20240111098
- Publication date Apr 4, 2024
- Intel Corporation
- Vineeth ABRAHAM
- G02 - OPTICS
Information Patent Application
SYSTEM AND APPARATUS HAVING A SEAL MEMBER FOR SEALING OF A DEVICE U...
- Publication number 20240068572
- Publication date Feb 29, 2024
- Intel Corporation
- Paul DIGLIO
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...
- Publication number 20230317549
- Publication date Oct 5, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DOCKING SELF-ALIGNED OPTICAL PCB CONNECTOR FOR SEMICONDUCTOR P...
- Publication number 20230314733
- Publication date Oct 5, 2023
- Intel Corporation
- Eric MORET
- G02 - OPTICS
Information Patent Application
DUAL FEED COLD SPRAY NOZZLE WITH SEPARATE TEMPERATURE AND FEEDING R...
- Publication number 20230285999
- Publication date Sep 14, 2023
- Intel Corporation
- Wenhao Li
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
REUSABLE COMPOSITE STENCIL FOR SPRAY PROCESSES
- Publication number 20230271445
- Publication date Aug 31, 2023
- Intel Corporation
- Feras Eid
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...
- Publication number 20230260870
- Publication date Aug 17, 2023
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
REWORKABLE ZERO-FORCE INSERTION ELECTRICAL OPTICAL PACKAGE SOCKET A...
- Publication number 20230185037
- Publication date Jun 15, 2023
- Intel Corporation
- Eric J. M. Moret
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR OPTICAL COUPLING TO PHOTONIC INTEGRATED CIRCUITS
- Publication number 20230095039
- Publication date Mar 30, 2023
- Intel Corporation
- Srikant Nekkanty
- G02 - OPTICS
Information Patent Application
METHOD AND SYSTEM FOR ATTACHING OPTICAL FIBERS TO WARPED PHOTONIC C...
- Publication number 20220011529
- Publication date Jan 13, 2022
- Intel Corporation
- Sufi AHMED
- G02 - OPTICS
Information Patent Application
METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY
- Publication number 20220011517
- Publication date Jan 13, 2022
- Intel Corporation
- Vineeth ABRAHAM
- G02 - OPTICS
Information Patent Application
ADDITIVELY MANUFACTURED STRUCTURES FOR HEAT DISSIPATION FROM INTEGR...
- Publication number 20210407884
- Publication date Dec 30, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PACKAGES INCLUDING A CONTIGUOUS HEAT SPREADER
- Publication number 20210407877
- Publication date Dec 30, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SILICON BACK END LAYERS FOR IMPROVED THERMAL PER...
- Publication number 20210391244
- Publication date Dec 16, 2021
- Intel Corporation
- Chandra Mohan JHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM MODULATED TWO PHASE COOLING LOOP EFFICIENCY AND PARALLELISM...
- Publication number 20210351108
- Publication date Nov 11, 2021
- Intel Corporation
- Paul Diglio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...
- Publication number 20210351106
- Publication date Nov 11, 2021
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM MODULATED TWO PHASE COOLING LOOP PERFORMANCE ENHANCEMENT
- Publication number 20210348624
- Publication date Nov 11, 2021
- Intel Corporation
- Paul DIGLIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE GIMBAL PLATFORM FOR HIGH-RESOLUTION IN SITU CO-PLANARIT...
- Publication number 20200371136
- Publication date Nov 26, 2020
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Application
DOUBLE-BEAM TEST PROBE
- Publication number 20200096567
- Publication date Mar 26, 2020
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL TESTING APPARATUS WITH LATERAL MOVEMENT OF A PROBE SUPPO...
- Publication number 20190204358
- Publication date Jul 4, 2019
- Paul Diglio
- G01 - MEASURING TESTING
Information Patent Application
LOW-PROFILE GIMBAL PLATFORM FOR HIGH-RESOLUTION IN SITU CO-PLANARIT...
- Publication number 20190101570
- Publication date Apr 4, 2019
- Intel Corporation
- PAUL J. DIGLIO
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR MEASURING SURFACE TEMPERATURE
- Publication number 20180172521
- Publication date Jun 21, 2018
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Application
Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...
- Publication number 20170176516
- Publication date Jun 22, 2017
- Intel Corporation
- Mohit Mamodia
- G01 - MEASURING TESTING
Information Patent Application
FLUID FLOW IN A TEMPERATURE CONTROL ACTUATOR FOR SEMICONDUCTOR DEVI...
- Publication number 20160377658
- Publication date Dec 29, 2016
- Intel Corporation
- Paul J. DIGLIO
- G01 - MEASURING TESTING
Information Patent Application
Fluid Flow Channel For Enhanced Heat Transfer Efficiency
- Publication number 20160033208
- Publication date Feb 4, 2016
- PHI HUNG THANH
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL INTERFACE MATERIAL HANDLING FOR THERMAL CONTROL OF AN ELECT...
- Publication number 20150276798
- Publication date Oct 1, 2015
- David Won-jun Song
- G01 - MEASURING TESTING
Information Patent Application
PLACING INTEGRATED CIRCUIT DEVICES USING PERTURBATION
- Publication number 20150185281
- Publication date Jul 2, 2015
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Application
COMPLIANT THERMAL CONTACT DEVICE AND METHOD
- Publication number 20140084953
- Publication date Mar 27, 2014
- Paul Diglio
- F28 - HEAT EXCHANGE IN GENERAL

Paul J. Diglio

Person

Patents Grantslast 30 patents

Integrated circuit die packages including a contiguous heat spreader

Additively manufactured structures for heat dissipation from integr...

Vacuum modulated two phase cooling loop efficiency and parallelism...

Thermally enhanced silicon back end layers for improved thermal per...

System and apparatus having a seal member for sealing of a device u...

Vacuum modulated two phase cooling loop performance enhancement

Method and device for fast, passive alignment in photonics assembly

Method and system for attaching optical fibers to warped photonic c...

Low-profile gimbal platform for high-resolution in situ co-planarit...

Double-beam test probe

Electrical testing apparatus with lateral movement of a probe suppo...

Low-profile gimbal platform for high-resolution in situ co-planarit...

Thermal head with a thermal barrier for integrated circuit die proc...

Systems and methods for measuring surface temperature

Fluid flow channel for enhanced heat transfer efficiency

Compliant thermal contact device and method

Placing integrated circuit devices using perturbation

Thermal interface material handling for thermal control of an elect...

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO REDUCE LEAKAGE OF COOLING FLUID USED TO CO...

ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT

METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY

SYSTEM AND APPARATUS HAVING A SEAL MEMBER FOR SEALING OF A DEVICE U...

POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...

SELF-DOCKING SELF-ALIGNED OPTICAL PCB CONNECTOR FOR SEMICONDUCTOR P...

DUAL FEED COLD SPRAY NOZZLE WITH SEPARATE TEMPERATURE AND FEEDING R...

REUSABLE COMPOSITE STENCIL FOR SPRAY PROCESSES

DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...

REWORKABLE ZERO-FORCE INSERTION ELECTRICAL OPTICAL PACKAGE SOCKET A...

TECHNOLOGIES FOR OPTICAL COUPLING TO PHOTONIC INTEGRATED CIRCUITS

METHOD AND SYSTEM FOR ATTACHING OPTICAL FIBERS TO WARPED PHOTONIC C...

METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY

ADDITIVELY MANUFACTURED STRUCTURES FOR HEAT DISSIPATION FROM INTEGR...

INTEGRATED CIRCUIT DIE PACKAGES INCLUDING A CONTIGUOUS HEAT SPREADER

THERMALLY ENHANCED SILICON BACK END LAYERS FOR IMPROVED THERMAL PER...

VACUUM MODULATED TWO PHASE COOLING LOOP EFFICIENCY AND PARALLELISM...

DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF...

VACUUM MODULATED TWO PHASE COOLING LOOP PERFORMANCE ENHANCEMENT

LOW-PROFILE GIMBAL PLATFORM FOR HIGH-RESOLUTION IN SITU CO-PLANARIT...

DOUBLE-BEAM TEST PROBE

ELECTRICAL TESTING APPARATUS WITH LATERAL MOVEMENT OF A PROBE SUPPO...

LOW-PROFILE GIMBAL PLATFORM FOR HIGH-RESOLUTION IN SITU CO-PLANARIT...

SYSTEMS AND METHODS FOR MEASURING SURFACE TEMPERATURE

Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...

FLUID FLOW IN A TEMPERATURE CONTROL ACTUATOR FOR SEMICONDUCTOR DEVI...

Fluid Flow Channel For Enhanced Heat Transfer Efficiency

THERMAL INTERFACE MATERIAL HANDLING FOR THERMAL CONTROL OF AN ELECT...

PLACING INTEGRATED CIRCUIT DEVICES USING PERTURBATION

COMPLIANT THERMAL CONTACT DEVICE AND METHOD