Paul J. Hundt

Person

Garland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material design for enhanced thermal performance...
- Patent number 8,304,897
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material design for enhanced thermal performance...
- Patent number 7,956,456
- Issue date Jun 7, 2011
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having a grid array of pin-attached balls
- Patent number 7,462,783
- Issue date Dec 9, 2008
- Texas Instruments Incorporated
- Gregory E. Howard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiant chamber for simultaneous rapid die attach and lead frame em...
- Patent number 6,226,452
- Issue date May 1, 2001
- Texas Instruments Incorporated
- Paul Joseph Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an ultrasonically welded plastic support ring
- Patent number 5,661,900
- Issue date Sep 2, 1997
- Texas Instruments Incorporated
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced molded cavity package having a parallel lid
- Patent number 5,650,915
- Issue date Jul 22, 1997
- Texas Instruments Incorporated
- Rafael Cesar Alfaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a thermally enhanced molded cavity packag...
- Patent number 5,458,716
- Issue date Oct 17, 1995
- Texas Instruments Incorporated
- Rafael C. Alfaro
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermal Interface Material Design for Enhanced Thermal Performance...
- Publication number 20110204506
- Publication date Aug 25, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THERMAL INTERFACE MATERIAL DESIGN FOR ENHANCED THERMAL PERFORMANCE...
- Publication number 20090212418
- Publication date Aug 27, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS
- Publication number 20090061566
- Publication date Mar 5, 2009
- TEXAS INSTRUMENTS INCORPORATED
- GREGORY E. HOWARD
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package having a grid array of pin-attached balls
- Publication number 20060021795
- Publication date Feb 2, 2006
- Gregory E. Howard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Particle-filled semiconductor attachment material
- Publication number 20040007780
- Publication date Jan 15, 2004
- Paul Joseph Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing saw having an annularly supported dicing blade
- Publication number 20030136394
- Publication date Jul 24, 2003
- TEXAS INSTRUMENTS INCORPORATED
- David B. Blair
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Paul J. Hundt

Person

Patents Grantslast 30 patents

Thermal interface material design for enhanced thermal performance...

Thermal interface material design for enhanced thermal performance...

Semiconductor package having a grid array of pin-attached balls

Radiant chamber for simultaneous rapid die attach and lead frame em...

Method of fabricating an ultrasonically welded plastic support ring

Thermally enhanced molded cavity package having a parallel lid

Methods for manufacturing a thermally enhanced molded cavity packag...

Patents Applicationslast 30 patents

Thermal Interface Material Design for Enhanced Thermal Performance...

THERMAL INTERFACE MATERIAL DESIGN FOR ENHANCED THERMAL PERFORMANCE...

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

Semiconductor package having a grid array of pin-attached balls

Particle-filled semiconductor attachment material

Dicing saw having an annularly supported dicing blade