Paul Koep

Person

Madison, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder material and method for die attachment
- Patent number 11,842,974
- Issue date Dec 12, 2023
- Alpha Assembly Solutions Inc.
- Angelo Gulino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials for use with interconnects of electrical devices and rela...
- Patent number 10,123,430
- Issue date Nov 6, 2018
- Alpha Assembly Solutions Inc.
- Michael T. Marczi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preforms and solder alloy assembly methods
- Patent number 9,801,285
- Issue date Oct 24, 2017
- Paul Joseph Koep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20200203304
- Publication date Jun 25, 2020
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Preforms and Solder Alloy Assembly Methods
- Publication number 20180020554
- Publication date Jan 18, 2018
- Alpha Assembly Solutions Inc.
- Paul Joseph Koep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RF SHIELD WITH SELECTIVELY INTEGRATED SOLDER
- Publication number 20170245404
- Publication date Aug 24, 2017
- Alpha Assembly Solutions Inc.
- Paul Joseph Koep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PREFORMS AND SOLDER ALLOY ASSEMBLY METHODS
- Publication number 20150078810
- Publication date Mar 19, 2015
- ALPHA METALS, INC.
- Paul Joseph Koep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT
- Publication number 20140328039
- Publication date Nov 6, 2014
- Paul J. Koep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR USE WITH INTERCONNECTS OF ELECTRICAL DEVICES AND RELA...
- Publication number 20080173698
- Publication date Jul 24, 2008
- Michael T. Marczi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Solder material and method for die attachment

Materials for use with interconnects of electrical devices and rela...

Solder preforms and solder alloy assembly methods

Patents Applicationslast 30 patents

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

Solder Preforms and Solder Alloy Assembly Methods

RF SHIELD WITH SELECTIVELY INTEGRATED SOLDER

SOLDER PREFORMS AND SOLDER ALLOY ASSEMBLY METHODS

SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT

MATERIALS FOR USE WITH INTERCONNECTS OF ELECTRICAL DEVICES AND RELA...