Paul Koning

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 9,247,686
- Issue date Jan 26, 2016
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 8,703,286
- Issue date Apr 22, 2014
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer coat layers and methods therefor
- Patent number 8,193,072
- Issue date Jun 5, 2012
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotube modified solder thermal intermediate structure, systems, a...
- Patent number 8,129,223
- Issue date Mar 6, 2012
- Intel Corporation
- Paul A. Koning
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal intermediate apparatus, systems, and methods
- Patent number 7,985,627
- Issue date Jul 26, 2011
- Intel Corporation
- Bryan M. White
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 7,967,942
- Issue date Jun 28, 2011
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Phase change material containing fusible particles as thermally con...
- Patent number 7,960,019
- Issue date Jun 14, 2011
- Intel Corporation
- Salkumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor wafer coat layers and methods therefor
- Patent number 7,897,486
- Issue date Mar 1, 2011
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader, heat sink or heat pipe with pre-attached...
- Patent number 7,846,778
- Issue date Dec 7, 2010
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component packaging apparatus, systems, and methods
- Patent number 7,816,171
- Issue date Oct 19, 2010
- Intel Corporation
- Paul A. Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic device having liquid crystalline epoxy resins
- Patent number 7,794,623
- Issue date Sep 14, 2010
- Intel Corporation
- James Christopher Matayabas, Jr.
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
No-flow underfill composition and method
- Patent number 7,619,318
- Issue date Nov 17, 2009
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-carbon and/or metal-carbon fiber composite heat spreader
- Patent number 7,534,650
- Issue date May 19, 2009
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level underfill process making use of sacrificial contact pad...
- Patent number 7,530,164
- Issue date May 12, 2009
- Intel Corporation
- Paul Koning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader, heat sink or heat pipe with pre-attached...
- Patent number 7,473,995
- Issue date Jan 6, 2009
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal intermediate apparatus, systems, and methods
- Patent number 7,456,052
- Issue date Nov 25, 2008
- Intel Corporation
- Bryan M. White
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystalline epoxy resins
- Patent number 7,417,111
- Issue date Aug 26, 2008
- Intel Corporation
- James Christopher Matayabas, Jr.
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Phase change thermal interface materials including polyester resin
- Patent number 7,408,787
- Issue date Aug 5, 2008
- Intel Corporation
- James Christopher Matayabas, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component packaging apparatus, systems, and methods
- Patent number 7,365,414
- Issue date Apr 29, 2008
- Intel Corporation
- Paul A. Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bumps formation using solder paste with shape retaining attr...
- Patent number 7,331,500
- Issue date Feb 19, 2008
- Intel Corporation
- Edward L. Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material and electronic assembly having such a th...
- Patent number 7,311,967
- Issue date Dec 25, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material containing fusible particles as thermally con...
- Patent number 7,294,394
- Issue date Nov 13, 2007
- Intel Corporation
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor wafer coat layers and methods therefor
- Patent number 7,279,362
- Issue date Oct 9, 2007
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 7,252,877
- Issue date Aug 7, 2007
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embossing processes for substrate imprinting, structures made there...
- Patent number 7,229,933
- Issue date Jun 12, 2007
- Intel Corporation
- Paul A. Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon-carbon and/or metal-carbon fiber composite heat spreaders
- Patent number 7,195,951
- Issue date Mar 27, 2007
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotube modified solder thermal intermediate structure, systems, a...
- Patent number 7,180,174
- Issue date Feb 20, 2007
- Intel Corporation
- Paul A. Koning
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-solid metal injection methods for electronic assembly thermal...
- Patent number 7,169,650
- Issue date Jan 30, 2007
- Intel Corporation
- Agostino C. Rinella
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermal interface apparatus, systems, and methods
- Patent number 7,168,484
- Issue date Jan 30, 2007
- Intel Corporation
- Yuegang Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Polymeric dielectric material for high-energy density capacitors
- Patent number 7,136,275
- Issue date Nov 14, 2006
- Intel Corporation
- Paul A. Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS
- Publication number 20140182763
- Publication date Jul 3, 2014
- Saikumar Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS
- Publication number 20110194254
- Publication date Aug 11, 2011
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOTUBE MODIFIED SOLDER THERMAL INTERMEDIATE STRUCTURE, SYSTEMS, A...
- Publication number 20110168763
- Publication date Jul 14, 2011
- Intel Corporation
- Paul A. Koning
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER COAT LAYERS AND METHODS THEREFOR
- Publication number 20110059596
- Publication date Mar 10, 2011
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERMEDIATE APPARATUS, SYSTEMS, AND METHODS
- Publication number 20090075430
- Publication date Mar 19, 2009
- Bryan M. White
- B82 - NANO-TECHNOLOGY
Information Patent Application
Microelectronic package, method of manufacturing same, and system i...
- Publication number 20080237841
- Publication date Oct 2, 2008
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMPS FORMATION USING SOLDER PASTE WITH SHAPE RETAINING ATTR...
- Publication number 20080092991
- Publication date Apr 24, 2008
- Edward L. Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT PACKAGING APPARATUS, SYSTEMS, AND METHODS
- Publication number 20080023817
- Publication date Jan 31, 2008
- Intel Corporation
- Paul Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Phase change material containing fusible particles as thermally con...
- Publication number 20070287005
- Publication date Dec 13, 2007
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Solder flux composition
- Publication number 20070284412
- Publication date Dec 13, 2007
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polymer matrices for polymer solder hybrid materials
- Publication number 20070251639
- Publication date Nov 1, 2007
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer coat layers and methods therefor
- Publication number 20070218652
- Publication date Sep 20, 2007
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embossing processes for substrate imprinting, structures made there...
- Publication number 20070182010
- Publication date Aug 9, 2007
- Paul A. Koning
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Negative thermal expansion material filler for low CTE composites
- Publication number 20070135550
- Publication date Jun 14, 2007
- Nirupama Chakrapani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS
- Publication number 20070119582
- Publication date May 31, 2007
- Intel Corporation
- Yuegang Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Carbon-carbon and/or metal-carbon fiber composite heat spreader
- Publication number 20070111383
- Publication date May 17, 2007
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer coat layers and methods therefor
- Publication number 20060223284
- Publication date Oct 5, 2006
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level underfill process making use of sacrificial contact pad...
- Publication number 20060121646
- Publication date Jun 8, 2006
- Paul Koning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No-flow underfill composition and method
- Publication number 20060025500
- Publication date Feb 2, 2006
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder bumps formation using solder paste with shape retaining attr...
- Publication number 20050284920
- Publication date Dec 29, 2005
- Edward L. Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhancing epoxy strength using kaolin filler
- Publication number 20050287714
- Publication date Dec 29, 2005
- Michael Walk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate imprinting techniques
- Publication number 20050260790
- Publication date Nov 24, 2005
- Michael D. Goodner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid crystalline epoxy resins
- Publication number 20050224753
- Publication date Oct 13, 2005
- James Christopher Matayabas
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Embossing processes for substrate imprinting, structures made there...
- Publication number 20050221597
- Publication date Oct 6, 2005
- Paul A. Koning
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic packages including nanocomposite dielectric build-u...
- Publication number 20050221605
- Publication date Oct 6, 2005
- Paul A. Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Phase change material containing fusible particles as thermally con...
- Publication number 20050214523
- Publication date Sep 29, 2005
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermal intermediate apparatus, systems, and methods
- Publication number 20050139991
- Publication date Jun 30, 2005
- Intel Corporation
- Bryan M. White
- B82 - NANO-TECHNOLOGY
Information Patent Application
Nanotube modified solder thermal intermediate structure, systems, a...
- Publication number 20050139642
- Publication date Jun 30, 2005
- Intel Corporation
- Paul A. Koning
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dielectric with fluorescent material
- Publication number 20050123860
- Publication date Jun 9, 2005
- Paul Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component packaging apparatus, systems, and methods
- Publication number 20050116299
- Publication date Jun 2, 2005
- Paul A. Koning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Paul Koning

Person

Patents Grantslast 30 patents

Polymer matrices for polymer solder hybrid materials

Polymer matrices for polymer solder hybrid materials

Semiconductor wafer coat layers and methods therefor

Nanotube modified solder thermal intermediate structure, systems, a...

Thermal intermediate apparatus, systems, and methods

Polymer matrices for polymer solder hybrid materials

Phase change material containing fusible particles as thermally con...

Semiconductor wafer coat layers and methods therefor

Integrated heat spreader, heat sink or heat pipe with pre-attached...

Component packaging apparatus, systems, and methods

Microelectronic device having liquid crystalline epoxy resins

No-flow underfill composition and method

Carbon-carbon and/or metal-carbon fiber composite heat spreader

Wafer-level underfill process making use of sacrificial contact pad...

Integrated heat spreader, heat sink or heat pipe with pre-attached...

Thermal intermediate apparatus, systems, and methods

Liquid crystalline epoxy resins

Phase change thermal interface materials including polyester resin

Component packaging apparatus, systems, and methods

Solder bumps formation using solder paste with shape retaining attr...

Thermal interface material and electronic assembly having such a th...

Phase change material containing fusible particles as thermally con...

Semiconductor wafer coat layers and methods therefor

Polymer matrices for polymer solder hybrid materials

Embossing processes for substrate imprinting, structures made there...

Carbon-carbon and/or metal-carbon fiber composite heat spreaders

Nanotube modified solder thermal intermediate structure, systems, a...

Semi-solid metal injection methods for electronic assembly thermal...

Thermal interface apparatus, systems, and methods

Polymeric dielectric material for high-energy density capacitors

Patents Applicationslast 30 patents

POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS

POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS

NANOTUBE MODIFIED SOLDER THERMAL INTERMEDIATE STRUCTURE, SYSTEMS, A...

SEMICONDUCTOR WAFER COAT LAYERS AND METHODS THEREFOR

THERMAL INTERMEDIATE APPARATUS, SYSTEMS, AND METHODS

Microelectronic package, method of manufacturing same, and system i...

SOLDER BUMPS FORMATION USING SOLDER PASTE WITH SHAPE RETAINING ATTR...

COMPONENT PACKAGING APPARATUS, SYSTEMS, AND METHODS

Phase change material containing fusible particles as thermally con...

Solder flux composition

Polymer matrices for polymer solder hybrid materials

Semiconductor wafer coat layers and methods therefor

Embossing processes for substrate imprinting, structures made there...

Negative thermal expansion material filler for low CTE composites

THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS

Carbon-carbon and/or metal-carbon fiber composite heat spreader

Semiconductor wafer coat layers and methods therefor

Wafer-level underfill process making use of sacrificial contact pad...

No-flow underfill composition and method

Solder bumps formation using solder paste with shape retaining attr...

Enhancing epoxy strength using kaolin filler

Substrate imprinting techniques

Liquid crystalline epoxy resins

Embossing processes for substrate imprinting, structures made there...

Microelectronic packages including nanocomposite dielectric build-u...

Phase change material containing fusible particles as thermally con...

Thermal intermediate apparatus, systems, and methods

Nanotube modified solder thermal intermediate structure, systems, a...

Dielectric with fluorescent material

Component packaging apparatus, systems, and methods