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Paul L. Sullivan
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Phoenix, AZ, US
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last 30 patents
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Patent Grant
Package assembly for an electronic component
Patent number
5,889,658
Issue date
Mar 30, 1999
Motorola, Inc.
Paul L. Sullivan
G01 - MEASURING TESTING
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Patent Grant
Semiconductor device on an opposed leadframe and method for making
Patent number
5,631,192
Issue date
May 20, 1997
Motorola, Inc.
Richard E. Heppler
H01 - BASIC ELECTRIC ELEMENTS