Paul M. Gaschke

Person

Pleasantville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for temporary thermal coupling of an electronic device to...
- Patent number 7,332,927
- Issue date Feb 19, 2008
- International Business Machines Corporation
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for temporary thermal coupling of an electroni...
- Patent number 7,259,580
- Issue date Aug 21, 2007
- International Business Machines Corporation
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Grant
High power space transformer
- Patent number 6,967,556
- Issue date Nov 22, 2005
- International Business Machines Corporation
- Paul M. Gaschke
- G01 - MEASURING TESTING
Information Patent Grant
Wafer probe interface arrangement with nonresilient probe elements...
- Patent number 6,426,636
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Gobinda Das
- G01 - MEASURING TESTING
Information Patent Grant
Off-axis contact tip and dense packing design for a fine pitch probe
- Patent number 6,411,112
- Issue date Jun 25, 2002
- International Business Machines Corporation
- Gobinda Das
- G01 - MEASURING TESTING
Information Patent Grant
Segmented architecture for wafer test and burn-in
- Patent number 6,275,051
- Issue date Aug 14, 2001
- International Business Machines Corporation
- Thomas W. Bachelder
- G01 - MEASURING TESTING
Information Patent Grant
Vertical probe housing
- Patent number 6,196,866
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Paul M. Gaschke
- G01 - MEASURING TESTING
Information Patent Grant
Cover assembly for a socket adaptable to IC modules of varying thic...
- Patent number 6,086,387
- Issue date Jul 11, 2000
- International Business Machines Corporation
- Ethan E. Gallagher
- G01 - MEASURING TESTING
Information Patent Grant
Large area multiple-chip probe assembly and method of making the same
- Patent number 5,977,787
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Gobina Das
- G01 - MEASURING TESTING
Information Patent Grant
Universal test and burn-in socket adaptable to varying IC module th...
- Patent number 5,748,007
- Issue date May 5, 1998
- International Business Machines Corporation
- Paul Mathew Gaschke
- G01 - MEASURING TESTING
Information Patent Grant
Liquid film interface cooling chuck for semiconductor wafer processing
- Patent number 5,186,238
- Issue date Feb 16, 1993
- International Business Machines Corporation
- Santiago E. del Puerto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid film interface cooling system for semiconductor wafer proces...
- Patent number 5,088,006
- Issue date Feb 11, 1992
- International Business Machines Corporation
- Santiago E. del Puerto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry interface thermal chuck temperature control system for semicond...
- Patent number 5,001,423
- Issue date Mar 19, 1991
- International Business Machines Corporation
- Anthony J. Abrami
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
HIGH POWER COBRA INTERPOSER WTIH INTEGRATED GUARD PLATE
- Publication number 20080143357
- Publication date Jun 19, 2008
- International Business Machines Corporation
- Paul M. Gaschke
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO...
- Publication number 20070285116
- Publication date Dec 13, 2007
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONI...
- Publication number 20060186909
- Publication date Aug 24, 2006
- International Business Machines Corporation
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Application
HIGH POWER SPACE TRANSFORMER
- Publication number 20040263304
- Publication date Dec 30, 2004
- International Business Machines Corporation
- Paul M Gaschke
- G01 - MEASURING TESTING
Information Patent Application
Segmented architecture for wafer test & burn-in
- Publication number 20010050567
- Publication date Dec 13, 2001
- International Business Machines Corporation
- Thomas W. Bachelder
- G01 - MEASURING TESTING

Paul M. Gaschke

Person

Patents Grantslast 30 patents

Apparatus for temporary thermal coupling of an electronic device to...

Method and apparatus for temporary thermal coupling of an electroni...

High power space transformer

Wafer probe interface arrangement with nonresilient probe elements...

Off-axis contact tip and dense packing design for a fine pitch probe

Segmented architecture for wafer test and burn-in

Vertical probe housing

Cover assembly for a socket adaptable to IC modules of varying thic...

Large area multiple-chip probe assembly and method of making the same

Universal test and burn-in socket adaptable to varying IC module th...

Liquid film interface cooling chuck for semiconductor wafer processing

Liquid film interface cooling system for semiconductor wafer proces...

Dry interface thermal chuck temperature control system for semicond...

Patents Applicationslast 30 patents

HIGH POWER COBRA INTERPOSER WTIH INTEGRATED GUARD PLATE

APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO...

METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONI...

HIGH POWER SPACE TRANSFORMER

Segmented architecture for wafer test & burn-in