Paul McGregor

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of copper electroplating to improve gapfill
- Patent number 7,438,794
- Issue date Oct 21, 2008
- Intel Corporation
- David Jentz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloys for interconnections having improved electromigration...
- Patent number 7,220,674
- Issue date May 22, 2007
- Intel Corporation
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloys for interconnections having improved electromigration...
- Patent number 6,977,220
- Issue date Dec 20, 2005
- Intel Corporation
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroless introduction of interconnect structures
- Patent number 6,977,224
- Issue date Dec 20, 2005
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloys for interconnections having improved electromigration...
- Patent number 6,800,554
- Issue date Oct 5, 2004
- Intel Corporation
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface alteration of metal interconnect in integrated circuits for...
- Patent number 6,794,755
- Issue date Sep 21, 2004
- Intel Corporation
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and a method of electroless introduction of...
- Patent number 6,696,758
- Issue date Feb 24, 2004
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Copper electroplating bath composition and a method of copper elect...
- Publication number 20060065536
- Publication date Mar 30, 2006
- David Jentz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper alloys for interconnections having improved electromigration...
- Publication number 20040224507
- Publication date Nov 11, 2004
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper alloys for interconnections having improved electromigration...
- Publication number 20040219788
- Publication date Nov 4, 2004
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD OF FORMING SURFACE ALTERATION OF METAL INTERCONNECT IN INT...
- Publication number 20040056366
- Publication date Mar 25, 2004
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface alteration of metal interconnect in integrated circuits for...
- Publication number 20040056329
- Publication date Mar 25, 2004
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures and a method of electroless introduction of...
- Publication number 20030071355
- Publication date Apr 17, 2003
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures and a method of electroless introduction of...
- Publication number 20020084529
- Publication date Jul 4, 2002
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper alloys for interconnections having improved electromigration...
- Publication number 20020076925
- Publication date Jun 20, 2002
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless method of seed layer depostion, repair, and fabrication...
- Publication number 20020064592
- Publication date May 30, 2002
- Madhav Datta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Paul McGregor

Person

Patents Grantslast 30 patents

Method of copper electroplating to improve gapfill

Copper alloys for interconnections having improved electromigration...

Copper alloys for interconnections having improved electromigration...

Method of electroless introduction of interconnect structures

Copper alloys for interconnections having improved electromigration...

Surface alteration of metal interconnect in integrated circuits for...

Interconnect structures and a method of electroless introduction of...

Patents Applicationslast 30 patents

Copper electroplating bath composition and a method of copper elect...

Copper alloys for interconnections having improved electromigration...

Copper alloys for interconnections having improved electromigration...

A METHOD OF FORMING SURFACE ALTERATION OF METAL INTERCONNECT IN INT...

Surface alteration of metal interconnect in integrated circuits for...

Interconnect structures and a method of electroless introduction of...

Interconnect structures and a method of electroless introduction of...

Copper alloys for interconnections having improved electromigration...

Electroless method of seed layer depostion, repair, and fabrication...