Paul Mescher

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated shield package and method
- Patent number 11,848,275
- Issue date Dec 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated shield package and method
- Patent number 10,886,235
- Issue date Jan 5, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated shield package and method
- Patent number 10,109,591
- Issue date Oct 23, 2018
- Amkor Technology, Inc.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package lid thermal interface material standoffs
- Patent number 9,892,990
- Issue date Feb 13, 2018
- Amkor Technology, Inc.
- Jesse E. Galloway
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED SHIELD PACKAGE AND METHOD
- Publication number 20240194615
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHIELD PACKAGE AND METHOD
- Publication number 20210193588
- Publication date Jun 24, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHIELD PACKAGE AND METHOD
- Publication number 20190057941
- Publication date Feb 21, 2019
- Amkor Technology, Inc.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS