Paul Qu

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Surface mount technology method and magnetic carrier system
- Patent number 12,114,435
- Issue date Oct 8, 2024
- SanDisk Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing keep-out-zone area for a semiconductor device
- Patent number 12,021,060
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged memory device with flip chip and wire bond dies
- Patent number 12,021,061
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- G11 - INFORMATION STORAGE
Information Patent Grant
Flip-chip package with reduced underfill area
- Patent number 11,837,476
- Issue date Dec 5, 2023
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HAVING AN INCREASED METAL TRACE THICKNESS
- Publication number 20240332156
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mount Technology Method and Magnetic Carrier System
- Publication number 20230371185
- Publication date Nov 16, 2023
- Western Digital Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED MEMORY DEVICE WITH FLIP CHIP AND WIRE BOND DIES
- Publication number 20220285316
- Publication date Sep 8, 2022
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING KEEP-OUT-ZONE AREA FOR A SEMICONDUCTOR DEVICE
- Publication number 20220093559
- Publication date Mar 24, 2022
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE WITH REDUCED UNDERFILL AREA
- Publication number 20210335628
- Publication date Oct 28, 2021
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS