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Shanghai, CN
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last 30 patents
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Patent Grant
Flip-chip package with reduced underfill area
Patent number
11,837,476
Issue date
Dec 5, 2023
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Surface Mount Technology Method and Magnetic Carrier System
Publication number
20230371185
Publication date
Nov 16, 2023
Western Digital Technologies, Inc.
Virgil Zhu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGED MEMORY DEVICE WITH FLIP CHIP AND WIRE BOND DIES
Publication number
20220285316
Publication date
Sep 8, 2022
Western Digital Technologies, Inc.
Rui Yuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCING KEEP-OUT-ZONE AREA FOR A SEMICONDUCTOR DEVICE
Publication number
20220093559
Publication date
Mar 24, 2022
Western Digital Technologies, Inc.
Kevin Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP PACKAGE WITH REDUCED UNDERFILL AREA
Publication number
20210335628
Publication date
Oct 28, 2021
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS