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Paul R. Hoffman
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Modesto, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Edge connectable metal package
Patent number
6,300,673
Issue date
Oct 9, 2001
Advanced Interconnect Technologies, Inc.
Paul R. Hoffman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array electronic package
Patent number
6,262,477
Issue date
Jul 17, 2001
Advanced Interconnect Technologies
Deepak Mahulikar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal ball grid electronic package having improved solder joint
Patent number
5,952,719
Issue date
Sep 14, 1999
Advanced Interconnect Technologies, Inc.
Peter W. Robinson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a ground or power ring and a metal sub...
Patent number
5,877,551
Issue date
Mar 2, 1999
Olin Corporation
Salvador A. Tostado
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array electronic package standoff design
Patent number
5,805,427
Issue date
Sep 8, 1998
Olin Corporation
Paul R. Hoffman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ground ring for a metal electronic package
Patent number
5,764,484
Issue date
Jun 9, 1998
Olin Corporation
Paul R. Hoffman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal ball grid array package with improved thermal conductivity
Patent number
5,629,835
Issue date
May 13, 1997
Olin Corporation
Deepak Mahulikar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Components for housing an integrated circuit device
Patent number
5,578,869
Issue date
Nov 26, 1996
Olin Corporation
Paul R. Hoffman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Guard ring for integrated circuit package
Patent number
5,545,850
Issue date
Aug 13, 1996
Olin Corporation
Deepak Mahulikar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package having improved wire bonding capability
Patent number
5,506,446
Issue date
Apr 9, 1996
Olin Corporation
Paul R. Hoffman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polymer plug for electronic packages
Patent number
5,477,008
Issue date
Dec 19, 1995
Olin Corporation
Anthony M. Pasqualoni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chamfered electronic package component
Patent number
5,455,386
Issue date
Oct 3, 1995
Olin Corporation
George A. Brathwaite
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with chip redistribution interposer
Patent number
5,455,387
Issue date
Oct 3, 1995
Olin Corporation
Paul R. Hoffman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal electronic package with reduced seal width
Patent number
5,399,805
Issue date
Mar 21, 1995
Olin Corporation
Derek E. Tyler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip electronic package module utilizing an adhesive sheet
Patent number
5,360,942
Issue date
Nov 1, 1994
Olin Corporation
Paul R. Hoffman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal electronic package with reduced seal width
Patent number
5,324,888
Issue date
Jun 28, 1994
Olin Corporation
Derek E. Tyler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package having controlled epoxy flow
Patent number
5,239,131
Issue date
Aug 24, 1993
Olin Corporation
Paul R. Hoffman
H01 - BASIC ELECTRIC ELEMENTS