Paul R. Moehle

Person

Attleboro, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Palladium-spot leadframes for high adhesion semiconductor devices a...
- Patent number 7,939,378
- Issue date May 10, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Palladium-spot leadframes for high adhesion semiconductor devices a...
- Patent number 7,245,006
- Issue date Jul 17, 2007
- Texas Instruments Incorporated
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gold spot plated leadframes for semiconductor devices and method of...
- Patent number 7,148,085
- Issue date Dec 12, 2006
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stabilizer/spacer for semiconductor device
- Patent number 6,956,282
- Issue date Oct 18, 2005
- Texas Instruments Incorporated
- Robert Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes for high adhesion semiconductor devices and method of fa...
- Patent number 6,953,986
- Issue date Oct 11, 2005
- Texas Instruments Incorporated
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Preplating of semiconductor small outline no-lead leadframes
- Patent number 6,838,757
- Issue date Jan 4, 2005
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gradient dragout system in a continuous plating line
- Patent number 6,780,253
- Issue date Aug 24, 2004
- Texas Instruments Incorporated
- Paul R. Moehle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gradient dragout system in a continuous plating line
- Patent number 6,443,167
- Issue date Sep 3, 2002
- Texas Instruments Incorporated
- Paul R. Moehle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming lead frames with preformation support
- Patent number 6,238,845
- Issue date May 29, 2001
- Texas Instruments Incorporated
- Paul R. Moehle
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Leadframes with selective palladium plating
- Patent number 6,194,777
- Issue date Feb 27, 2001
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Comparator for monitoring the deposition of an electrically conduct...
- Patent number 6,187,153
- Issue date Feb 13, 2001
- Texas Instruments Incorporated
- David M. Drew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated solution electroplating system and process
- Patent number 6,187,166
- Issue date Feb 13, 2001
- Texas Instruments Incorporated
- Paul R. Moehle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Comparator for monitoring the deposition of an electrically conduct...
- Patent number 6,019,886
- Issue date Feb 1, 2000
- Texas Instruments Incorporated
- David M. Drew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating system
- Patent number 5,104,510
- Issue date Apr 14, 1992
- Texas Instruments Incorporated
- Paul R. Moehle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Palladium-Spot Leadframes for High Adhesion Semiconductor Devices a...
- Publication number 20070243665
- Publication date Oct 18, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Palladium-spot leadframes for high adhesion semiconductor devices a...
- Publication number 20060001132
- Publication date Jan 5, 2006
- Donald C. Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Gold spot plated leadframes for semiconductor devices and method of...
- Publication number 20040113241
- Publication date Jun 17, 2004
- Donald C. Abbott
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...
- Publication number 20030011048
- Publication date Jan 16, 2003
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gradient dragout system in a continuous plating line
- Publication number 20020179121
- Publication date Dec 5, 2002
- Paul R. Moehle
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Palladium-spot leadframes for high adhesion semiconductor devices a...
- Publication number 20020070434
- Publication date Jun 13, 2002
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Preplating of semiconductor small outline no-lead leadframes
- Publication number 20020003292
- Publication date Jan 10, 2002
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS

Paul R. Moehle

Person

Patents Grantslast 30 patents

Palladium-spot leadframes for high adhesion semiconductor devices a...

Palladium-spot leadframes for high adhesion semiconductor devices a...

Gold spot plated leadframes for semiconductor devices and method of...

Stabilizer/spacer for semiconductor device

Leadframes for high adhesion semiconductor devices and method of fa...

Preplating of semiconductor small outline no-lead leadframes

Gradient dragout system in a continuous plating line

Gradient dragout system in a continuous plating line

Method of forming lead frames with preformation support

Leadframes with selective palladium plating

Comparator for monitoring the deposition of an electrically conduct...

Integrated solution electroplating system and process

Comparator for monitoring the deposition of an electrically conduct...

Plating system

Patents Applicationslast 30 patents

Palladium-Spot Leadframes for High Adhesion Semiconductor Devices a...

Palladium-spot leadframes for high adhesion semiconductor devices a...

Gold spot plated leadframes for semiconductor devices and method of...

SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...

Gradient dragout system in a continuous plating line

Palladium-spot leadframes for high adhesion semiconductor devices a...

Preplating of semiconductor small outline no-lead leadframes