TREA

Paul Schweitzer

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  • Corvallis, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Molded substrates
    • Patent number 11,784,072
    • Issue date Oct 10, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael Wayne Cumbie
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cassette substrates made of polyetherimide
    • Patent number 11,318,458
    • Issue date May 3, 2022
    • Hewlett-Packard Development Company, L.P.
    • Gary G. Lutnesky
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Grant

    Encapsulating electrical connections
    • Patent number 7,691,675
    • Issue date Apr 6, 2010
    • Hewlett-Packard Development Company, L.P.
    • Carlos B. W. Garcia
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Fluid ejection device and manufacturing method
    • Patent number 7,673,971
    • Issue date Mar 9, 2010
    • Hewlett-Packard Development Company, L.P.
    • Dale D. Timm
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device and manufacturing method
    • Patent number 7,651,196
    • Issue date Jan 26, 2010
    • Hewlett-Packard Development Company, L.P.
    • Dale D. Timm
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device and manufacturing method
    • Patent number 7,240,991
    • Issue date Jul 10, 2007
    • Hewlett-Packard Development Company, L.P.
    • Dale D. Timm
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

  • Information Patent Application

    MOLDED SUBSTRATES
    • Publication number 20230110990
    • Publication date Apr 13, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael Wayne Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    METAL TRACES
    • Publication number 20230092697
    • Publication date Mar 23, 2023
    • Hewlett-Packard Development Company, L.P.
    • Anthony Donald Studer
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    ELECTRICAL CONNECTORS
    • Publication number 20220396077
    • Publication date Dec 15, 2022
    • Hewlett-Packard Development Company, L.P.
    • Paul David Schweitzer
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    CASSETTE SUBSTRATES MADE OF POLYETHERIMIDE
    • Publication number 20200061602
    • Publication date Feb 27, 2020
    • Hewlett-Packard Development Company, L.P.
    • Gary G. Lutnesky
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    Fluid ejection device and manufacturing method
    • Publication number 20070236531
    • Publication date Oct 11, 2007
    • Dale D. Timm
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    Fluid ejection device and manufacturing method
    • Publication number 20070236538
    • Publication date Oct 11, 2007
    • Dale D. Timm
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    Encapsulating electrical connections
    • Publication number 20070093001
    • Publication date Apr 26, 2007
    • Carlos B.W. Garcia
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    Fluid ejection device and manufacturing method
    • Publication number 20050200669
    • Publication date Sep 15, 2005
    • Hewlett-Packard Development Company, L.P.
    • Dale D. Timm
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS