Paul SOUTHWORTH

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Groesbeek, NL

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Patents Grantslast 30 patents

Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress pad structure for packaged devices
- Patent number 10,937,750
- Issue date Mar 2, 2021
- NXP B.V.
- Paul Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die and antenna array device
- Patent number 10,593,635
- Issue date Mar 17, 2020
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR
- Publication number 20250038138
- Publication date Jan 30, 2025
- NXP B.V.
- Ting Hsun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE
- Publication number 20240413192
- Publication date Dec 12, 2024
- NXP B.V.
- Paul Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS PAD STRUCTURE FOR PACKAGED DEVICES
- Publication number 20210050317
- Publication date Feb 18, 2021
- NXP B.V.
- Paul Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE AND ANTENNA ARRAY DEVICE
- Publication number 20190304934
- Publication date Oct 3, 2019
- NXP B.V.
- Antonius Hendrikus Jozef KAMPHUIS
- H01 - BASIC ELECTRIC ELEMENTS