Paul T. Lin

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Dallas, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Package with solder-filled via holes in molding layers
- Patent number 7,667,338
- Issue date Feb 23, 2010
- Paul T. Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip-embedded support-frame board wrapped by folded flexible circui...
- Patent number 7,408,253
- Issue date Aug 5, 2008
- Paul T. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package-to-package stacking by using interposer with traces, and or...
- Publication number 20120020040
- Publication date Jan 26, 2012
- Paul T. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package with solder-filled via holes in molding layers
- Publication number 20080036050
- Publication date Feb 14, 2008
- Paul T. Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Chip-embedded support-frame board wrapped by folded flexible circui...
- Publication number 20060228830
- Publication date Oct 12, 2006
- Paul T. Lin
- H01 - BASIC ELECTRIC ELEMENTS