Paul Wong

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Johor, MY

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Patents Grantslast 30 patents

Information Patent Grant
Assembling device used for semiconductor equipment
- Patent number 10,418,264
- Issue date Sep 17, 2019
- Hermes-Epitek Corporation
- Tsan-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas injector and cover plate assembly for semiconductor equipment
- Patent number 9,855,575
- Issue date Jan 2, 2018
- Hermes-Epitek Corporation
- Tsan-Hua Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas injector and cover plate assembly for semiconductor equipment
- Patent number 9,427,762
- Issue date Aug 30, 2016
- Hermes-Epitek Corporation
- Tsan-Hua Huang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLING DEVICE USED FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20170358463
- Publication date Dec 14, 2017
- HERMES-EPITEK CORPORATION
- Tsan-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING DEVICE USED FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20170358473
- Publication date Dec 14, 2017
- HERMES-EPITEK CORPORATION
- Tsan-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS INJECTOR AND COVER PLATE ASSEMBLY FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20160244876
- Publication date Aug 25, 2016
- HERMES-EPITEK CORPORATION
- Tsan-Hua Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Gas Injector and Cover Plate Assembly for Semiconductor Equipment
- Publication number 20140239091
- Publication date Aug 28, 2014
- HERMES-EPITEK CORPORATION
- Tsan-Hua Huang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...