Pauli Jaervinen

Person

Wallerfing, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna on ceramics for a packaged die
- Patent number 10,319,688
- Issue date Jun 11, 2019
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 10,249,598
- Issue date Apr 2, 2019
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 9,972,601
- Issue date May 15, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk acoustic wave resonator tuner circuits
- Patent number 9,819,327
- Issue date Nov 14, 2017
- Intel IP Corporation
- Saravana Maruthamuthu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device with capacitive coupling structure
- Patent number 8,779,564
- Issue date Jul 15, 2014
- Intel IP Corporation
- Mikael Knudsen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20230023328
- Publication date Jan 26, 2023
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20180315737
- Publication date Nov 1, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20180197840
- Publication date Jul 12, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20160276311
- Publication date Sep 22, 2016
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA ON CERAMICS FOR A PACKAGED DIE
- Publication number 20160240492
- Publication date Aug 18, 2016
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR TUNER CIRCUITS
- Publication number 20150333401
- Publication date Nov 19, 2015
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS

Pauli Jaervinen

Person

Patents Grantslast 30 patents

Integrated circuit package having wirebonded multi-die stack

Antenna on ceramics for a packaged die

Integrated circuit package having wirebonded multi-die stack

Integrated circuit package having wirebonded multi-die stack

Bulk acoustic wave resonator tuner circuits

Semiconductor device with capacitive coupling structure

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

ANTENNA ON CERAMICS FOR A PACKAGED DIE

BULK ACOUSTIC WAVE RESONATOR TUNER CIRCUITS