Pei-Chang Wang

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned source/drain metal contact
- Patent number 12,356,645
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metal gate cut and structure thereof
- Patent number 12,347,690
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate device with air gap spacer and fabrication methods thereof
- Patent number 12,300,720
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide interlayer structure for NFET and PFET
- Patent number 12,300,739
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,300,728
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a transformer
- Patent number 12,266,465
- Issue date Apr 1, 2025
- Champion Microelectronic Corp.
- Pao Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field plate structure for high voltage device
- Patent number 12,249,629
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Cheng Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside via
- Patent number 12,249,575
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 12,243,780
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices having gate-all-around...
- Patent number 12,218,226
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-opening container
- Patent number 12,202,642
- Issue date Jan 21, 2025
- SOUTH PLASTIC INDUSTRY CO., LTD.
- Tong-Chang Wang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Dual channel gate all around transistor device and fabrication meth...
- Patent number 12,198,986
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Sheng Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,148,837
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Bo Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around structure and methods of forming the same
- Patent number 12,148,836
- Issue date Nov 19, 2024
- Parabellum Strategic Opportunities Fund LLC
- Pei-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with wraparound backside amorphous layer
- Patent number 12,148,805
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for boosting performance of FinFETs via strained...
- Patent number 12,148,830
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET devices and methods of forming the same
- Patent number 12,148,673
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual gate structures for semiconductor devices
- Patent number 12,132,108
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chih Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid source drain regions formed based on same fin and methods fo...
- Patent number 12,119,270
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate all around structure with additional silicon layer and method...
- Patent number 12,119,404
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside power rail and methods of fabri...
- Patent number 12,094,973
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with gate cut structure and method of forming...
- Patent number 12,057,341
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Servo joint safety position monitoring apparatus and method
- Patent number 12,032,352
- Issue date Jul 9, 2024
- Mantis Robotics, Inc.
- Gerry Vannuffelen
- G05 - CONTROLLING REGULATING
Information Patent Grant
Barrier-free interconnect structure and manufacturing method thereof
- Patent number 12,009,293
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metal gate cut and structure thereof
- Patent number 11,996,293
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FET with wrap-around silicide and fabrication methods thereof
- Patent number 11,996,483
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fully oxidized gate oxide layer and met...
- Patent number 11,990,545
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsu-Hsiu Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,984,402
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250226271
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250203994
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-Guan JHOU
Information Patent Application
FIELD EFFECT TRANSISTOR HAVING REPLACEMENT SOURCE/DRAINS AND RELATE...
- Publication number 20250203955
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Chih HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CFET DEVICE BY INTERPOSER LAYER REPLACEMENT AND R...
- Publication number 20250203970
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guan-Lin CHEN
Information Patent Application
COMPLEMENTARY FIELD EFFECT TRANSISTOR AND RELATED METHODS
- Publication number 20250204037
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Chih HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERALLY-DIFFUSED METAL-OXIDE SEMICONDUCTOR (LDMOS) DEVICE AND MET...
- Publication number 20250194143
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-YING LAI
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE VIA
- Publication number 20250183159
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING NANOSTRUCTURE TRANSISTOR AND METHODS OF...
- Publication number 20250185306
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250159801
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20250157970
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING NANOSTRUCTURE DEVICE BY INTERPOSER LAYER REPLACEM...
- Publication number 20250151326
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guan-Lin CHEN
Information Patent Application
SEMICONDUCTOR DEVICES HAVING GATE-ALL-AROUND STRUCTURE AND METHODS...
- Publication number 20250142857
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsiung LIN
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250098300
- Publication date Mar 20, 2025
- AUO Corporation
- HSIN-HUA TSAI
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250071889
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- G01 - MEASURING TESTING
Information Patent Application
LASER WELDING MECHANISM
- Publication number 20250058412
- Publication date Feb 20, 2025
- GENII IDEAS CO., LTD.
- KUO CHIANG TSENG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH WRAPAROUND BACKSIDE AMORPHOUS LAYER
- Publication number 20250006807
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395861
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBIOTICS SEPARATED FROM RABBIT FECES AND FOOD CONTAINING PROBIOTICS
- Publication number 20240390438
- Publication date Nov 28, 2024
- AGENT Innovation Co., Ltd.
- JYH HORNG SHYU
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...
- Publication number 20240387732
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Gate Structures For Semiconductor Devices
- Publication number 20240387726
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chih SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20240387287
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CIRCUIT BOARD
- Publication number 20240389224
- Publication date Nov 21, 2024
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GATE-ALL-AROUND STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379857
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Pei-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BOOSTING PERFORMANCE OF FINFETS VIA STRAINED...
- Publication number 20240379849
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SOURCE/DRAIN FEATURES
- Publication number 20240379807
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240372008
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Bo Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GATE CUT STRUCTURE AND METHOD OF FORMING...
- Publication number 20240363396
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SOURCE DRAIN REGIONS FORMED BASED ON SAME FIN AND METHODS FO...
- Publication number 20240363440
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER-FREE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332169
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR METAL GATE CUT AND STRUCTURE THEREOF
- Publication number 20240332022
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Pei-Chang Wang

Person

Patents Grantslast 30 patents

Self-aligned source/drain metal contact

Method for metal gate cut and structure thereof

Multi-gate device with air gap spacer and fabrication methods thereof

Metal oxide interlayer structure for NFET and PFET

Semiconductor devices

Manufacturing method of a transformer

Semiconductor device package and a method of manufacturing the same

Field plate structure for high voltage device

Integrated circuit structure with backside via

Semiconductor device structure and method for forming the same

Methods of fabricating semiconductor devices having gate-all-around...

Hybrid channel semiconductor device and method

Anti-opening container

Dual channel gate all around transistor device and fabrication meth...

Semiconductor devices

Gate-all-around structure and methods of forming the same

Semiconductor structure with wraparound backside amorphous layer

Method and device for boosting performance of FinFETs via strained...

FinFET devices and methods of forming the same

Dual gate structures for semiconductor devices

Hybrid source drain regions formed based on same fin and methods fo...

Gate all around structure with additional silicon layer and method...

Semiconductor devices with backside power rail and methods of fabri...

Semiconductor device with gate cut structure and method of forming...

Servo joint safety position monitoring apparatus and method

Barrier-free interconnect structure and manufacturing method thereof

Method for metal gate cut and structure thereof

FET with wrap-around silicide and fabrication methods thereof

Semiconductor device having fully oxidized gate oxide layer and met...

Semiconductor device and method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

FIELD EFFECT TRANSISTOR HAVING REPLACEMENT SOURCE/DRAINS AND RELATE...

METHOD OF FORMING CFET DEVICE BY INTERPOSER LAYER REPLACEMENT AND R...

COMPLEMENTARY FIELD EFFECT TRANSISTOR AND RELATED METHODS

LATERALLY-DIFFUSED METAL-OXIDE SEMICONDUCTOR (LDMOS) DEVICE AND MET...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE VIA

SEMICONDUCTOR DEVICE HAVING NANOSTRUCTURE TRANSISTOR AND METHODS OF...

FLEXIBLE CIRCUIT BOARD

FLIP CHIP STRUCTURE AND CIRCUIT BOARD THEREOF

METHOD OF FORMING NANOSTRUCTURE DEVICE BY INTERPOSER LAYER REPLACEM...

SEMICONDUCTOR DEVICES HAVING GATE-ALL-AROUND STRUCTURE AND METHODS...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

FLEXIBLE CIRCUIT BOARD

LASER WELDING MECHANISM

SEMICONDUCTOR STRUCTURE WITH WRAPAROUND BACKSIDE AMORPHOUS LAYER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROBIOTICS SEPARATED FROM RABBIT FECES AND FOOD CONTAINING PROBIOTICS

SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...

Dual Gate Structures For Semiconductor Devices

FINFET DEVICES AND METHODS OF FORMING THE SAME

THIN FILM CIRCUIT BOARD

GATE-ALL-AROUND STRUCTURE AND METHODS OF FORMING THE SAME

METHOD AND DEVICE FOR BOOSTING PERFORMANCE OF FINFETS VIA STRAINED...

METAL SOURCE/DRAIN FEATURES

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH GATE CUT STRUCTURE AND METHOD OF FORMING...

HYBRID SOURCE DRAIN REGIONS FORMED BASED ON SAME FIN AND METHODS FO...

BARRIER-FREE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR METAL GATE CUT AND STRUCTURE THEREOF