Pei-Geng Weng

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and carrier thereof and method for manufacturing...
- Patent number 12,255,165
- Issue date Mar 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and carrier thereof and method for manufacturing...
- Patent number 12,027,484
- Issue date Jul 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and circuit structure thereof
- Patent number 11,791,300
- Issue date Oct 17, 2023
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...
- Publication number 20240321798
- Publication date Sep 26, 2024
- SILICONWARE PRECISION INDUST RIES CO., LT D.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20240312889
- Publication date Sep 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282655
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222290
- Publication date Jul 4, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20230066456
- Publication date Mar 2, 2023
- Siliconware Precision Industries Co., Ltd.
- Pei-Geng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...
- Publication number 20220392861
- Publication date Dec 8, 2022
- SILICONWARE PRECISION INDUST RIES CO., LT D.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20220148996
- Publication date May 12, 2022
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Pei-Geng Weng

Person

Patents Grantslast 30 patents

Electronic package and carrier thereof and method for manufacturing...

Electronic package and carrier thereof and method for manufacturing...

Electronic package and circuit structure thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE

ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF