Pei-Hsiu PENG

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure
- Patent number 12,288,689
- Issue date Apr 29, 2025
- Winbond Electronics Corp.
- Pei-Hsiu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate semiconductor structure and method of manufacturing the...
- Patent number 12,107,162
- Issue date Oct 1, 2024
- Winbond Electronics Corp.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory and method for manufacturing the same
- Patent number 11,690,214
- Issue date Jun 27, 2023
- Winbond Electronics Corp.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250218776
- Publication date Jul 3, 2025
- WINBOND ELECTRONICS CORP.
- Pei-Hsiu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240006178
- Publication date Jan 4, 2024
- WINBOND ELECTRONICS CORP.
- Pei-Hsiu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220216210
- Publication date Jul 7, 2022
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE...
- Publication number 20210257491
- Publication date Aug 19, 2021
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS