Pei-Hua WANG

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 12,176,284
- Issue date Dec 24, 2024
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistors having a backside channel contact for high de...
- Patent number 12,150,297
- Issue date Nov 19, 2024
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of thin film fin transistor structure
- Patent number 12,080,781
- Issue date Sep 3, 2024
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having differentiated interconnect li...
- Patent number 12,080,643
- Issue date Sep 3, 2024
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor separations in dielectric layers
- Patent number 11,991,873
- Issue date May 21, 2024
- Intel Corporation
- Travis W. Lajoie
Information Patent Grant
Passivation layers for thin film transistors and methods of fabrica...
- Patent number 11,955,560
- Issue date Apr 9, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory architecture with shared bitline at back-end-of-line
- Patent number 11,950,407
- Issue date Apr 2, 2024
- Intel Corporation
- Juan G. Alzate Vinasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistors with offset source and drain structures and p...
- Patent number 11,929,415
- Issue date Mar 12, 2024
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistors with raised source and drain contacts and pro...
- Patent number 11,908,911
- Issue date Feb 20, 2024
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor connections in dielectric layers
- Patent number 11,832,438
- Issue date Nov 28, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel formation for three dimensional transistors
- Patent number 11,810,980
- Issue date Nov 7, 2023
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation gap filling process for embedded dram using spacer material
- Patent number 11,784,088
- Issue date Oct 10, 2023
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor embedded dynamic random-access memory with sha...
- Patent number 11,758,711
- Issue date Sep 12, 2023
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making memory cells based on thin-film transistors
- Patent number 11,683,929
- Issue date Jun 20, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate separation layers at the back-end-of-line
- Patent number 11,652,047
- Issue date May 16, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor separations in dielectric layers
- Patent number 11,610,894
- Issue date Mar 21, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of contact patterning of thin film transistors for embedded...
- Patent number 11,563,107
- Issue date Jan 24, 2023
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cells based on vertical thin-film transistors
- Patent number 11,462,541
- Issue date Oct 4, 2022
- Intel Corporation
- Juan G. Alzate Vinasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked thin-film transistor based embedded dynamic random-access m...
- Patent number 11,450,669
- Issue date Sep 20, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor structures with gas spacer
- Patent number 11,404,536
- Issue date Aug 2, 2022
- Intel Corporation
- Travis W. LaJoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cells based on thin-film transistors
- Patent number 11,393,927
- Issue date Jul 19, 2022
- Intel Coropration
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor embedded dynamic random-access memory with sha...
- Patent number 11,329,047
- Issue date May 10, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 11,121,073
- Issue date Sep 14, 2021
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVATION LAYERS FOR THIN FILM TRANSISTORS AND METHODS OF FABRICA...
- Publication number 20240234579
- Publication date Jul 11, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS
- Publication number 20240049450
- Publication date Feb 8, 2024
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS
- Publication number 20230200043
- Publication date Jun 22, 2023
- Intel Corporation
- Travis W. LAJOIE
Information Patent Application
TWO TRANSISTOR MEMORY CELL USING STACKED THIN-FILM TRANSISTORS
- Publication number 20230171936
- Publication date Jun 1, 2023
- Intel Corporation
- Abhishek A. Sharma
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUITS WITH INTERCONNECT LINERS
- Publication number 20230097793
- Publication date Mar 30, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER MEMORY STACKING WITH LINES SHARED BETWEEN BOTTOM AND TOP ME...
- Publication number 20230067765
- Publication date Mar 2, 2023
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITORS AND METHODS OF FABRICATION
- Publication number 20220415896
- Publication date Dec 29, 2022
- Intel Corporation
- Juan G. Alzate-Vinasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL WORDLINE ASSEMBLY FOR EMBEDDED DRAM
- Publication number 20220415897
- Publication date Dec 29, 2022
- Intel Corporation
- Juan G. Alzate-Vinasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE THIN FILM TRANSISTORS WITH MULTI-COMPOSITION GATE DIELE...
- Publication number 20220359758
- Publication date Nov 10, 2022
- Intel Corporation
- Shailesh Kumar Madisetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER
- Publication number 20220320275
- Publication date Oct 6, 2022
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELLS BASED ON THIN-FILM TRANSISTORS
- Publication number 20220310849
- Publication date Sep 29, 2022
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...
- Publication number 20220208770
- Publication date Jun 30, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THIN FILM FIN TRANSISTOR STRUCTURE
- Publication number 20220199807
- Publication date Jun 23, 2022
- Intel Corporation
- Noriyuki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTORS HAVING A BACKSIDE CHANNEL CONTACT FOR HIGH DE...
- Publication number 20220199628
- Publication date Jun 23, 2022
- Intel Corporation
- Noriyuki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR SOURCE/DRAIN CONTACTS
- Publication number 20220181460
- Publication date Jun 9, 2022
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE RESISTANCE THIN FILM RESISTOR FOR INTEGRATED CIRCUITS
- Publication number 20220102271
- Publication date Mar 31, 2022
- Intel Corporation
- Chieh-Jen KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR CAP-CHANNEL ARRANGEMENTS
- Publication number 20220059704
- Publication date Feb 24, 2022
- Intel Corporation
- Chieh-jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE WALL CAPACITORS AND METHODS OF FABRICATION
- Publication number 20210408002
- Publication date Dec 30, 2021
- Intel Corporation
- Travis W. LaJoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYERS FOR THIN FILM TRANSISTORS AND METHODS OF FABRICA...
- Publication number 20210408291
- Publication date Dec 30, 2021
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR
- Publication number 20210366821
- Publication date Nov 25, 2021
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARCHITECTURE WITH SHARED BITLINE AT BACK-END-OF-LINE
- Publication number 20210305255
- Publication date Sep 30, 2021
- Intel Corporation
- Juan G. ALZATE VINASCO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS
- Publication number 20210125992
- Publication date Apr 29, 2021
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED INTERCONNECT LI...
- Publication number 20210098373
- Publication date Apr 1, 2021
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS
- Publication number 20200411520
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNEL FORMATION FOR THREE DIMENSIONAL TRANSISTORS
- Publication number 20200411697
- Publication date Dec 31, 2020
- Intel Corporation
- Chieh-Jen KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERMEDIATE SEPARATION LAYERS AT THE BACK-END-OF-LINE
- Publication number 20200411426
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAPS AND CAPACITORS IN DIELECTRIC LAYERS
- Publication number 20200411635
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS
- Publication number 20200411525
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTORS WITH OFFSET SOURCE AND DRAIN STRUCTURES AND P...
- Publication number 20200403076
- Publication date Dec 24, 2020
- Intel Corporation
- Chieh-Jen KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTORS WITH RAISED SOURCE AND DRAIN CONTACTS AND PRO...
- Publication number 20200365701
- Publication date Nov 19, 2020
- Intel Corporation
- Chieh-Jen KU
- H01 - BASIC ELECTRIC ELEMENTS

Pei-Hua WANG

Person

Patents Grantslast 30 patents

Through plate interconnect for a vertical MIM capacitor

Thin film transistors having a backside channel contact for high de...

Fabrication of thin film fin transistor structure

Integrated circuit structures having differentiated interconnect li...

Capacitor separations in dielectric layers

Passivation layers for thin film transistors and methods of fabrica...

Memory architecture with shared bitline at back-end-of-line

Thin film transistors with offset source and drain structures and p...

Thin film transistors with raised source and drain contacts and pro...

Capacitor connections in dielectric layers

Channel formation for three dimensional transistors

Isolation gap filling process for embedded dram using spacer material

Thin-film transistor embedded dynamic random-access memory with sha...

Method for making memory cells based on thin-film transistors

Intermediate separation layers at the back-end-of-line

Capacitor separations in dielectric layers

Method of contact patterning of thin film transistors for embedded...

Memory cells based on vertical thin-film transistors

Stacked thin-film transistor based embedded dynamic random-access m...

Thin-film transistor structures with gas spacer

Memory cells based on thin-film transistors

Thin-film transistor embedded dynamic random-access memory with sha...

Through plate interconnect for a vertical MIM capacitor

Patents Applicationslast 30 patents

PASSIVATION LAYERS FOR THIN FILM TRANSISTORS AND METHODS OF FABRICA...

CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS

CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS

TWO TRANSISTOR MEMORY CELL USING STACKED THIN-FILM TRANSISTORS

INTEGRATED CIRCUITS WITH INTERCONNECT LINERS

BILAYER MEMORY STACKING WITH LINES SHARED BETWEEN BOTTOM AND TOP ME...

DECOUPLING CAPACITORS AND METHODS OF FABRICATION

MULTILEVEL WORDLINE ASSEMBLY FOR EMBEDDED DRAM

METAL OXIDE THIN FILM TRANSISTORS WITH MULTI-COMPOSITION GATE DIELE...

THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER

MEMORY CELLS BASED ON THIN-FILM TRANSISTORS

THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...

FABRICATION OF THIN FILM FIN TRANSISTOR STRUCTURE

THIN FILM TRANSISTORS HAVING A BACKSIDE CHANNEL CONTACT FOR HIGH DE...

TRANSISTOR SOURCE/DRAIN CONTACTS

TUNABLE RESISTANCE THIN FILM RESISTOR FOR INTEGRATED CIRCUITS

TRANSISTOR CAP-CHANNEL ARRANGEMENTS

DOUBLE WALL CAPACITORS AND METHODS OF FABRICATION

PASSIVATION LAYERS FOR THIN FILM TRANSISTORS AND METHODS OF FABRICA...

THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR

MEMORY ARCHITECTURE WITH SHARED BITLINE AT BACK-END-OF-LINE

INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS

INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED INTERCONNECT LI...

CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS

CHANNEL FORMATION FOR THREE DIMENSIONAL TRANSISTORS

INTERMEDIATE SEPARATION LAYERS AT THE BACK-END-OF-LINE

AIR GAPS AND CAPACITORS IN DIELECTRIC LAYERS

CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS

THIN FILM TRANSISTORS WITH OFFSET SOURCE AND DRAIN STRUCTURES AND P...

THIN FILM TRANSISTORS WITH RAISED SOURCE AND DRAIN CONTACTS AND PRO...