Pei-Ren Jeng

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor method and device
- Patent number 12,191,212
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Cheng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing
- Patent number 12,170,228
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,159,925
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device and method of forming
- Patent number 12,094,778
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jeng-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and methods of manufacturing semiconductor devices
- Patent number 12,087,845
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an undoped region under a source/drain
- Patent number 12,068,395
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Ku Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing a thin film and a method therefor
- Patent number 12,014,922
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsai-Fu Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,002,854
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heng-Wen Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layer over FinFET and method of forming same
- Patent number 11,948,840
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method and device
- Patent number 11,854,901
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsiung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supportive layer in source/drains of FinFET devices
- Patent number 11,855,142
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Chi Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 11,798,984
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfacial layer between fin and source/drain region
- Patent number 11,735,668
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yun Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacture
- Patent number 11,710,777
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Growth process and methods thereof
- Patent number 11,710,781
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin Chu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with enlarged volu...
- Patent number 11,581,425
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfacial layer between Fin and source/drain region
- Patent number 11,482,620
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yun Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supportive layer in source/drains of FinFET devices
- Patent number 11,476,331
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Chi Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,437,497
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method and device
- Patent number 11,367,660
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsiung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ straining epitaxial process
- Patent number 11,302,782
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing a thin film and a method therefor
- Patent number 11,244,822
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Fu Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 11,239,310
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wavy profile mitigation
- Patent number 11,232,988
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Wen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,211,470
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Ku Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,171,209
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heng-Wen Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned insulated film for high-K metal gate device
- Patent number 11,094,545
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,087,987
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for spatial atomic layer deposition
- Patent number 11,008,654
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anthony Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interfacial layer between fin and source/drain region
- Patent number 10,944,005
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yun Chin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240371983
- Publication date Nov 7, 2024
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN UNDOPED REGION UNDER A SOURCE/DRAIN
- Publication number 20240363729
- Publication date Oct 31, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Meng-Ku Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING
- Publication number 20240363418
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20240274667
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Heng-Wen Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTIVE LAYER IN SOURCE/DRAINS OF FINFET DEVICES
- Publication number 20240096958
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Chi Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING
- Publication number 20230402326
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20230387273
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Growth Process And Methods Thereof
- Publication number 20230317831
- Publication date Oct 5, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Pin Chu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacturing
- Publication number 20230064844
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROWTH PROCESS AND METHODS THEREOF
- Publication number 20230064078
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin Chu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD AND DEVICE
- Publication number 20230019633
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Cheng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Bending Reduction Through Structure Design
- Publication number 20230011474
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field-Effect Transistor Device and Method of Forming
- Publication number 20220415715
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interfacial Layer Between Fin and Source/Drain Region
- Publication number 20220376049
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yun Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220367690
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTIVE LAYER IN SOURCE/DRAINS OF FINFET DEVICES
- Publication number 20220367630
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Chi Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20220344490
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Undoped Region Under Source/Drain And Method Forming Same
- Publication number 20220336640
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Ku Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Method and Device
- Publication number 20220328358
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsiung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH ENLARGED VOLU...
- Publication number 20220293773
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Situ Straining Epitaxial Process
- Publication number 20220238656
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING A THIN FILM AND A METHOD THEREFOR
- Publication number 20220181143
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Fu HSIAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Seamless Gap Fill
- Publication number 20220157934
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacture
- Publication number 20220130979
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220059655
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Heng-Wen Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVY PROFILE MITIGATION
- Publication number 20210375688
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shu-Wen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20210366715
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ta-Chun Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interfacial Layer Between Fin and Source/Drain Region
- Publication number 20210193831
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yun Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20210119013
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Ku Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Method and Device
- Publication number 20210098308
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsiung Yen
- H01 - BASIC ELECTRIC ELEMENTS

Pei-Ren Jeng

Person

Patents Grantslast 30 patents

Semiconductor method and device

Semiconductor device and methods of manufacturing

Semiconductor device and method

Fin field-effect transistor device and method of forming

System and methods of manufacturing semiconductor devices

Method for forming an undoped region under a source/drain

Apparatus for manufacturing a thin film and a method therefor

Semiconductor device and method of manufacture

Protective layer over FinFET and method of forming same

Semiconductor method and device

Supportive layer in source/drains of FinFET devices

Seamless gap fill

Interfacial layer between fin and source/drain region

Semiconductor device and method for manufacture

Growth process and methods thereof

Method for manufacturing semiconductor structure with enlarged volu...

Interfacial layer between Fin and source/drain region

Supportive layer in source/drains of FinFET devices

Semiconductor device and method

Semiconductor method and device

In-situ straining epitaxial process

Apparatus for manufacturing a thin film and a method therefor

Seamless gap fill

Wavy profile mitigation

Semiconductor device and method

Semiconductor device and method of manufacture

Self-aligned insulated film for high-K metal gate device

Semiconductor device and method

Apparatus and method for spatial atomic layer deposition

Interfacial layer between fin and source/drain region

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES

METHOD FOR FORMING AN UNDOPED REGION UNDER A SOURCE/DRAIN

FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING

Semiconductor Device and Method of Manufacture

SUPPORTIVE LAYER IN SOURCE/DRAINS OF FINFET DEVICES

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING

SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Growth Process And Methods Thereof

Semiconductor Device and Methods of Manufacturing

GROWTH PROCESS AND METHODS THEREOF

SEMICONDUCTOR METHOD AND DEVICE

Fin Bending Reduction Through Structure Design

Fin Field-Effect Transistor Device and Method of Forming

Interfacial Layer Between Fin and Source/Drain Region

Semiconductor Device and Method

SUPPORTIVE LAYER IN SOURCE/DRAINS OF FINFET DEVICES

SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Undoped Region Under Source/Drain And Method Forming Same

Semiconductor Method and Device

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH ENLARGED VOLU...

In-Situ Straining Epitaxial Process

APPARATUS FOR MANUFACTURING A THIN FILM AND A METHOD THEREFOR

Seamless Gap Fill

Semiconductor Device and Method for Manufacture

Semiconductor Device and Method of Manufacture

WAVY PROFILE MITIGATION

Semiconductor Device and Method

Interfacial Layer Between Fin and Source/Drain Region

Semiconductor Device and Method

Semiconductor Method and Device