Pei-Ye Wang

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-axial via structure
- Patent number 11,792,918
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Pei-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Torque sensor
- Patent number 11,714,013
- Issue date Aug 1, 2023
- Pegatron Corporation
- Wen-Hung Wang
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,641,720
- Issue date May 2, 2023
- Unimicron Technology Corp.
- Pei-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,600,936
- Issue date Mar 7, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of the chip package structure having at least...
- Patent number 11,562,972
- Issue date Jan 24, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,545,412
- Issue date Jan 3, 2023
- Unimicron Technology Corp.
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display and rotating method thereof
- Patent number 11,336,215
- Issue date May 17, 2022
- Pegatron Corporation
- Tai-Jung Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Chip package structure having at least one chip and at least one th...
- Patent number 11,145,610
- Issue date Oct 12, 2021
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board structure
- Patent number 11,114,782
- Issue date Sep 7, 2021
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate structure and manufacturing method thereof
- Patent number 10,863,618
- Issue date Dec 8, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of light emitting device package structure wit...
- Patent number 10,854,803
- Issue date Dec 1, 2020
- Unimicron Technology Corp.
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head up display system and control method thereof
- Patent number 10,795,166
- Issue date Oct 6, 2020
- Pegatron Corporation
- Kuang-Ping Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device package structure with circuit redistribution...
- Patent number 10,651,358
- Issue date May 12, 2020
- Unimicron Technology Corp.
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holder to constrain elastic members of a receptacle
- Patent number 10,224,673
- Issue date Mar 5, 2019
- Hewlett-Packard Development Company, L.P.
- Chia-Min Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and kit for the field diagnosis of caprine arthritis-encepha...
- Patent number 10,161,012
- Issue date Dec 25, 2018
- NATIONAL TAIWAN UNIVERSITY
- Pei-Hwa Wang
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Operational amplifier circuit
- Patent number 9,112,453
- Issue date Aug 18, 2015
- Novatek Microelectronics Corp.
- Pei-Ye Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device
- Patent number 7,855,897
- Issue date Dec 21, 2010
- ASUSTeK COMPUTER Inc.
- Shi-Tan Lin
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20240282687
- Publication date Aug 22, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVE DEVICE
- Publication number 20220403891
- Publication date Dec 22, 2022
- PEGATRON CORPORATION
- Wen-Hung Wang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TORQUE SENSOR
- Publication number 20220291064
- Publication date Sep 15, 2022
- PEGATRON CORPORATION
- Wen-Hung Wang
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
CO-AXIAL VIA STRUCTURE
- Publication number 20220240368
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Pei-Wei WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220230949
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220095464
- Publication date Mar 24, 2022
- Unimicron Technology Corp.
- Pei-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF THE CHIP PACKAGE STRUCTURE
- Publication number 20210398925
- Publication date Dec 23, 2021
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MOUNTS
- Publication number 20210289652
- Publication date Sep 16, 2021
- Hewlett-Packard Development Company, L.P.
- Yao Wen Fan
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210273356
- Publication date Sep 2, 2021
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210202407
- Publication date Jul 1, 2021
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY AND ROTATING METHOD THEREOF
- Publication number 20210152114
- Publication date May 20, 2021
- PEGATRON CORPORATION
- Tai-Jung Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
OPTICAL WAVEGUIDE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20210096298
- Publication date Apr 1, 2021
- Subtron Technology Co., Ltd.
- Pei-Wei Wang
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210074606
- Publication date Mar 11, 2021
- Unimicron Technology Corp.
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200366012
- Publication date Nov 19, 2020
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LIGHT EMITTING DEVICE PACKAGE STRUCTURE WIT...
- Publication number 20200235272
- Publication date Jul 23, 2020
- Unimicron Technology Corp.
- Pei-Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200196440
- Publication date Jun 18, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20200118989
- Publication date Apr 16, 2020
- Unimicron Technology Corp.
- Pei-Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20200006610
- Publication date Jan 2, 2020
- Unimicron Technology Corp.
- Pei-Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAD UP DISPLAY SYSTEM AND CONTROL METHOD THEREOF
- Publication number 20190278094
- Publication date Sep 12, 2019
- PEGATRON CORPORATION
- Kuang-Ping Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND KIT FOR THE FIELD DIAGNOSIS OF CAPRINE ARTHRITIS-ENCEPHA...
- Publication number 20180237868
- Publication date Aug 23, 2018
- National Taiwan University
- Pei-Hwa WANG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
AUDIO EQUIPMENT AND ELECTRONIC DEVICE THEREOF
- Publication number 20180138875
- Publication date May 17, 2018
- Inventec (Pudong) Technology Corporation
- Kun-Hui LAI
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
Holder to Constrain Elastic Members of a Receptacle
- Publication number 20180062313
- Publication date Mar 1, 2018
- Hewlett-Packard Development Company, L.P.
- CHIA-MIN SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE DRIVER AND OPERATION METHOD THEREOF
- Publication number 20150042637
- Publication date Feb 12, 2015
- NOVATEK MICROELECTRONICS CORP.
- Li-Tang Lin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
OPERATIONAL AMPLIFIER CIRCUIT
- Publication number 20140306768
- Publication date Oct 16, 2014
- NOVATEK MICROELECTRONICS CORP.
- Pei-Ye Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method and System for Accessing Data
- Publication number 20090077299
- Publication date Mar 19, 2009
- LAYERWALKER TECHNOLOGY, INC.
- Pei-Feng Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20080055839
- Publication date Mar 6, 2008
- ASUSTEK COMPUTER INC.
- Shi-Tan Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flexible package fabrication method
- Publication number 20020182778
- Publication date Dec 5, 2002
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS

Pei-Ye Wang

Person

Patents Grantslast 30 patents

Circuit board having laminated build-up layers

Co-axial via structure

Torque sensor

Circuit board and manufacturing method thereof

Circuit board structure

Manufacturing method of the chip package structure having at least...

Package structure and manufacturing method thereof

Display and rotating method thereof

Chip package structure having at least one chip and at least one th...

Method of manufacturing circuit board structure

Composite substrate structure and manufacturing method thereof

Manufacturing method of light emitting device package structure wit...

Head up display system and control method thereof

Light emitting device package structure with circuit redistribution...

Holder to constrain elastic members of a receptacle

Method and kit for the field diagnosis of caprine arthritis-encepha...

Operational amplifier circuit

Electronic device

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF CIRCUIT BOARD

DRIVE DEVICE

TORQUE SENSOR

CO-AXIAL VIA STRUCTURE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF THE CHIP PACKAGE STRUCTURE

DEVICE MOUNTS

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

DISPLAY AND ROTATING METHOD THEREOF

OPTICAL WAVEGUIDE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF LIGHT EMITTING DEVICE PACKAGE STRUCTURE WIT...

COMPOSITE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...

LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...

HEAD UP DISPLAY SYSTEM AND CONTROL METHOD THEREOF

METHOD AND KIT FOR THE FIELD DIAGNOSIS OF CAPRINE ARTHRITIS-ENCEPHA...

AUDIO EQUIPMENT AND ELECTRONIC DEVICE THEREOF

Holder to Constrain Elastic Members of a Receptacle

SOURCE DRIVER AND OPERATION METHOD THEREOF

OPERATIONAL AMPLIFIER CIRCUIT

Method and System for Accessing Data

ELECTRONIC DEVICE

Flexible package fabrication method