Peijun Ding

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 10,047,430
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a diffusion barrier layer and a metal conduct...
- Patent number 9,991,157
- Issue date Jun 5, 2018
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-cost high-efficiency solar module using epitaxial Si thin-film...
- Patent number 9,537,032
- Issue date Jan 3, 2017
- SolarCity Corporation
- Jiunn Benjamin Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing a diffusion barrier layer and a metal conduct...
- Patent number 9,390,970
- Issue date Jul 12, 2016
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stackable multi-port gas nozzles
- Patent number 8,968,473
- Issue date Mar 3, 2015
- Silevo, Inc.
- Steve Poppe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Scalable, high-throughput, multi-chamber epitaxial reactor for sili...
- Patent number 8,845,809
- Issue date Sep 30, 2014
- Silevo, Inc.
- Steve Poppe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,696,875
- Issue date Apr 15, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,668,816
- Issue date Mar 11, 2014
- Applied Materials Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Scalable, high-throughput, multi-chamber epitaxial reactor for sili...
- Patent number 8,652,259
- Issue date Feb 18, 2014
- Silevo, Inc.
- Steve Poppe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solar cells fabricated by using CVD epitaxial Si films on metallurg...
- Patent number 8,637,761
- Issue date Jan 28, 2014
- Silevo, Inc.
- Jianming Fu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Sputtering of thermally resistive materials including metal chalcog...
- Patent number 8,500,963
- Issue date Aug 6, 2013
- Applied Materials, Inc.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protective offset sputtering
- Patent number 8,460,519
- Issue date Jun 11, 2013
- Applied Materials Inc.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protective offset sputtering
- Patent number 8,454,804
- Issue date Jun 4, 2013
- Applied Materials Inc.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a uniform barrier layer and metal seed layer w...
- Patent number 8,158,511
- Issue date Apr 17, 2012
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a uniform metal seed layer over a plurality of...
- Patent number 7,989,343
- Issue date Aug 2, 2011
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin film deposition
- Patent number 7,884,032
- Issue date Feb 8, 2011
- Applied Materials, Inc.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Small scanned magentron
- Patent number 7,807,030
- Issue date Oct 5, 2010
- Applied Materials, Inc.
- Ilyoung Richard Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer over recessed feature surfa...
- Patent number 7,795,138
- Issue date Sep 14, 2010
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-component doping of copper seed layer
- Patent number 7,749,361
- Issue date Jul 6, 2010
- Applied Materials, Inc.
- Jie Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal / metal nitride barrier layer for semiconductor device applic...
- Patent number 7,687,909
- Issue date Mar 30, 2010
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mechanism for varying the spacing between sputter magnetron and target
- Patent number 7,674,360
- Issue date Mar 9, 2010
- Applied Materials, Inc.
- Ilyoung Richard Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a sculptured copper seed layer
- Patent number 7,589,016
- Issue date Sep 15, 2009
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shields usable with an inductively coupled plasma reactor
- Patent number 7,569,125
- Issue date Aug 4, 2009
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer on semiconductor substrates
- Patent number 7,381,639
- Issue date Jun 3, 2008
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputter deposition and etching of metallization seed layer for over...
- Patent number 7,294,574
- Issue date Nov 13, 2007
- Applied Materials, Inc.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a tantalum nitride/tantalum diffusion barrier...
- Patent number 7,253,109
- Issue date Aug 7, 2007
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnetron executing planetary motion adjacent a sputtering target
- Patent number 7,169,271
- Issue date Jan 30, 2007
- Applied Materials, Inc.
- Ilyoung Richard Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer on semiconductor substrates
- Patent number 7,074,714
- Issue date Jul 11, 2006
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sidewall magnet improving uniformity of inductively coupled plasma...
- Patent number 7,041,201
- Issue date May 9, 2006
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sequential sputter and reactive precleans of vias and contacts
- Patent number 7,014,887
- Issue date Mar 21, 2006
- Applied Materials, Inc.
- Barney M. Cohen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-COST HIGH-EFFICIENCY SOLAR MODULE USING EPITAXIAL SI THIN-FILM...
- Publication number 20170148943
- Publication date May 25, 2017
- SOLARCITY CORPORATION
- Jiunn Benjamin Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCT...
- Publication number 20160322255
- Publication date Nov 3, 2016
- Applied Materials, Inc.
- Tony CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-PORT GAS NOZZLES
- Publication number 20150176127
- Publication date Jun 25, 2015
- SILEVO, INC.
- Steve Poppe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20140305802
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROTECTIVE OFFSET SPUTTERING
- Publication number 20130327641
- Publication date Dec 12, 2013
- Mengqi YE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a uniform barrier layer and metal seed layer w...
- Publication number 20110256716
- Publication date Oct 20, 2011
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR MAGNETRON METALLIZATION FOR SEMICONDUCTOR...
- Publication number 20110220494
- Publication date Sep 15, 2011
- PEIJUN DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-PORT GAS NOZZLES
- Publication number 20110067632
- Publication date Mar 24, 2011
- SIERRA SOLAR POWER, INC.
- Steve Poppe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-COST HIGH-EFFICIENCY SOLAR MODULE USING EPITAXIAL SI THIN-FILM...
- Publication number 20100300506
- Publication date Dec 2, 2010
- SIERRA SOLAR POWER, INC.
- Jiunn Benjamin Heng
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
HIGH EFFICIENCY LOW COST CRYSTALLINE-SI THIN FILM SOLAR MODULE
- Publication number 20100300507
- Publication date Dec 2, 2010
- SIERRA SOLAR POWER, INC.
- Jiunn Benjamin Heng
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of depositing a uniform metal seed layer over a plurality of...
- Publication number 20100255678
- Publication date Oct 7, 2010
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SCALABLE, HIGH-THROUGHPUT, MULTI-CHAMBER EPITAXIAL REACTOR FOR SILI...
- Publication number 20100092697
- Publication date Apr 15, 2010
- SIERRA SOLAR POWER, INC.
- Steve Poppe
- C30 - CRYSTAL GROWTH
Information Patent Application
SCALABLE, HIGH-THROUGHPUT, MULTI-CHAMBER EPITAXIAL REACTOR FOR SILI...
- Publication number 20100092698
- Publication date Apr 15, 2010
- SIERRA SOLAR POWER, INC.
- Steve Poppe
- C30 - CRYSTAL GROWTH
Information Patent Application
SOLAR CELLS FABRICATED BY USING CVD EPITAXIAL SI FILMS ON METALLURG...
- Publication number 20100065111
- Publication date Mar 18, 2010
- SIERRA SOLAR POWER, INC.
- Jianming Fu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of depositing a metal seed layer over recessed feature surfa...
- Publication number 20090269922
- Publication date Oct 29, 2009
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20090233438
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Peijun DING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHALCOGENIDE TARGET AND METHOD
- Publication number 20090107834
- Publication date Apr 30, 2009
- APPLIED MATERIALS, INC.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a diffusion barrier layer which provides an im...
- Publication number 20090053888
- Publication date Feb 26, 2009
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a sculptured copper seed layer
- Publication number 20080166869
- Publication date Jul 10, 2008
- APPLIED MATERIALS, INC.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20080110747
- Publication date May 15, 2008
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING OF THERMALLY RESISTIVE MATERIALS INCLUDING METAL CHALCOG...
- Publication number 20080099326
- Publication date May 1, 2008
- Applied Meterials, Inc.
- MENGQI YE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-component doping of copper seed layer
- Publication number 20070278089
- Publication date Dec 6, 2007
- Applied Materials, Inc.
- Jie Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal / metal nitride barrier layer for semiconductor device applic...
- Publication number 20070241458
- Publication date Oct 18, 2007
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Damage-free sculptured coating deposition
- Publication number 20070178682
- Publication date Aug 2, 2007
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Small Scanned Magentron
- Publication number 20070102284
- Publication date May 10, 2007
- Applied Materials, Inc.
- Ilyoung Richard Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Protective offset sputtering
- Publication number 20070095651
- Publication date May 3, 2007
- APPLIED MATERIALS, INC.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Protective offset sputtering
- Publication number 20070095650
- Publication date May 3, 2007
- APPLIED MATERIALS, INC.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Thin film deposition
- Publication number 20070099438
- Publication date May 3, 2007
- APPLIED MATERIALS, INC.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer on semiconductor substrates
- Publication number 20070020922
- Publication date Jan 25, 2007
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Peijun Ding

Person

Patents Grantslast 30 patents

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method for depositing a diffusion barrier layer and a metal conduct...

Low-cost high-efficiency solar module using epitaxial Si thin-film...

Method for depositing a diffusion barrier layer and a metal conduct...

Stackable multi-port gas nozzles

Scalable, high-throughput, multi-chamber epitaxial reactor for sili...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Scalable, high-throughput, multi-chamber epitaxial reactor for sili...

Solar cells fabricated by using CVD epitaxial Si films on metallurg...

Sputtering of thermally resistive materials including metal chalcog...

Protective offset sputtering

Protective offset sputtering

Method of depositing a uniform barrier layer and metal seed layer w...

Method of depositing a uniform metal seed layer over a plurality of...

Thin film deposition

Small scanned magentron

Method of depositing a metal seed layer over recessed feature surfa...

Multi-component doping of copper seed layer

Metal / metal nitride barrier layer for semiconductor device applic...

Mechanism for varying the spacing between sputter magnetron and target

Method of depositing a sculptured copper seed layer

Shields usable with an inductively coupled plasma reactor

Method of depositing a metal seed layer on semiconductor substrates

Sputter deposition and etching of metallization seed layer for over...

Method of depositing a tantalum nitride/tantalum diffusion barrier...

Magnetron executing planetary motion adjacent a sputtering target

Method of depositing a metal seed layer on semiconductor substrates

Sidewall magnet improving uniformity of inductively coupled plasma...

Sequential sputter and reactive precleans of vias and contacts

Patents Applicationslast 30 patents

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

LOW-COST HIGH-EFFICIENCY SOLAR MODULE USING EPITAXIAL SI THIN-FILM...

METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCT...

STACKABLE MULTI-PORT GAS NOZZLES

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

PROTECTIVE OFFSET SPUTTERING

Method of depositing a uniform barrier layer and metal seed layer w...

METHODS AND APPARATUS FOR MAGNETRON METALLIZATION FOR SEMICONDUCTOR...

STACKABLE MULTI-PORT GAS NOZZLES

LOW-COST HIGH-EFFICIENCY SOLAR MODULE USING EPITAXIAL SI THIN-FILM...

HIGH EFFICIENCY LOW COST CRYSTALLINE-SI THIN FILM SOLAR MODULE

Method of depositing a uniform metal seed layer over a plurality of...

SCALABLE, HIGH-THROUGHPUT, MULTI-CHAMBER EPITAXIAL REACTOR FOR SILI...

SCALABLE, HIGH-THROUGHPUT, MULTI-CHAMBER EPITAXIAL REACTOR FOR SILI...

SOLAR CELLS FABRICATED BY USING CVD EPITAXIAL SI FILMS ON METALLURG...

Method of depositing a metal seed layer over recessed feature surfa...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

CHALCOGENIDE TARGET AND METHOD

Method of depositing a diffusion barrier layer which provides an im...

Method of depositing a sculptured copper seed layer

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

SPUTTERING OF THERMALLY RESISTIVE MATERIALS INCLUDING METAL CHALCOG...

Multi-component doping of copper seed layer

Metal / metal nitride barrier layer for semiconductor device applic...

Damage-free sculptured coating deposition

Small Scanned Magentron

Protective offset sputtering

Protective offset sputtering

Thin film deposition

Method of depositing a metal seed layer on semiconductor substrates