Peipei Dong

Person

Wujiang, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Metal material with thermodynamic anisotropy and a method of prepar...
- Patent number 11,802,345
- Issue date Oct 31, 2023
- SUZHOU SHINHAO MATERIALS LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal material with thermodynamic anisotropy and a method of prepar...
- Patent number 11,242,607
- Issue date Feb 8, 2022
- Suzhou Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveler, leveler composition and method for electrodeposition of me...
- Patent number 10,683,275
- Issue date Jun 16, 2020
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveler, leveler composition and method for electrodeposition of me...
- Patent number 10,323,015
- Issue date Jun 18, 2019
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveling composition and method for electrodeposition of metals in...
- Patent number 9,920,023
- Issue date Mar 20, 2018
- Suzhou Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveling composition and method for electrodeposition of metals in...
- Patent number 9,551,081
- Issue date Jan 24, 2017
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
- Publication number 20240328023
- Publication date Oct 3, 2024
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR ELECTROPLATING NANOGRAINED COPPER
- Publication number 20230257896
- Publication date Aug 17, 2023
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL MATERIAL WITH THERMODYNAMIC ANISOTROPY AND A METHOD OF PREPAR...
- Publication number 20220127742
- Publication date Apr 28, 2022
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
- Publication number 20220064813
- Publication date Mar 3, 2022
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
A METAL MATERIAL WITH THERMODYNAMIC ANISOTROPY AND A METHOD OF PREP...
- Publication number 20210017660
- Publication date Jan 21, 2021
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELER, LEVELER COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF ME...
- Publication number 20190263773
- Publication date Aug 29, 2019
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN...
- Publication number 20170101389
- Publication date Apr 13, 2017
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Leveler, Leveler Composition and Method for Electrodeposition of Me...
- Publication number 20170029400
- Publication date Feb 2, 2017
- Shinhao Materials LLC
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN...
- Publication number 20150368819
- Publication date Dec 24, 2015
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Peipei Dong

Person

Patents Grantslast 30 patents

Metal material with thermodynamic anisotropy and a method of prepar...

Metal material with thermodynamic anisotropy and a method of prepar...

Leveler, leveler composition and method for electrodeposition of me...

Leveler, leveler composition and method for electrodeposition of me...

Leveling composition and method for electrodeposition of metals in...

Leveling composition and method for electrodeposition of metals in...

Patents Applicationslast 30 patents

METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM

METHOD FOR ELECTROPLATING NANOGRAINED COPPER

METAL MATERIAL WITH THERMODYNAMIC ANISOTROPY AND A METHOD OF PREPAR...

METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM

A METAL MATERIAL WITH THERMODYNAMIC ANISOTROPY AND A METHOD OF PREP...

LEVELER, LEVELER COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF ME...

LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN...

Leveler, Leveler Composition and Method for Electrodeposition of Me...

LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN...