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Peng CHANG
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Nirasaki City, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Cu wiring forming method and semiconductor device manufacturing method
Patent number
10,163,699
Issue date
Dec 25, 2018
Tokyo Electron Limited
Hiroyuki Nagai
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of manufacturing Cu wiring
Patent number
10,096,548
Issue date
Oct 9, 2018
Tokyo Electron Limited
Kenji Matsumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method and storage medium
Patent number
9,735,046
Issue date
Aug 15, 2017
Tokyo Electron Limited
Peng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming copper wiring
Patent number
9,362,166
Issue date
Jun 7, 2016
Tokyo Electron Limited
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manganese metal film forming method, processing system, electronic...
Patent number
9,136,132
Issue date
Sep 15, 2015
Tokyo Electron Limited
Kenji Matsumoto
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
Cu WIRING FORMING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20180047624
Publication date
Feb 15, 2018
TOKYO ELECTRON LIMITED
Hiroyuki Nagai
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND STORAGE MEDIUM
Publication number
20170062269
Publication date
Mar 2, 2017
TOKYO ELECTRON LIMITED
Peng CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING Cu WIRING
Publication number
20160276218
Publication date
Sep 22, 2016
TOKYO ELECTRON LIMITED
Kenji MATSUMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING COPPER WIRING
Publication number
20150262872
Publication date
Sep 17, 2015
TOKYO ELECTRON LIMITED
Tadahiro ISHIZAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANGANESE METAL FILM FORMING METHOD, PROCESSING SYSTEM, ELECTRONIC...
Publication number
20140183743
Publication date
Jul 3, 2014
TOKYO ELECTRON LIMITED
Kenji MATSUMOTO
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...