Peng Cheng Lin

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wraparound assembly for combination touch, handwriting and fingerpr...
- Patent number 8,724,038
- Issue date May 13, 2014
- QUALCOMM MEMS Technologies, Inc.
- Srinivasan Kodaganallur Ganapathi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method of preventing damage to metal traces of flexible...
- Patent number 7,643,305
- Issue date Jan 5, 2010
- QUALCOMM MEMS Technologies, Inc.
- Peng Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer module device and method
- Patent number 6,452,790
- Issue date Sep 17, 2002
- Acquis Technology, Inc.
- William W. Y. Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for reducing thermal cycling in a semiconductor p...
- Patent number 5,901,043
- Issue date May 4, 1999
- National Semiconductor Corporation
- Peng-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system circuit package directly supporting components on...
- Patent number 5,504,370
- Issue date Apr 2, 1996
- National Semiconductor Corporation
- Peng-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip modules and method of manufacturing
- Patent number 5,502,289
- Issue date Mar 26, 1996
- National Semiconductor Corporation
- Hem P. Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip modules and method of manufacturing
- Patent number 5,495,398
- Issue date Feb 27, 1996
- National Semiconductor Corporation
- Hem P. Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for isolated circuits
- Patent number 5,491,360
- Issue date Feb 13, 1996
- National Semiconductor Corporation
- Peng-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame including an inductor or other such magnetic component
- Patent number 5,428,245
- Issue date Jun 27, 1995
- National Semiconductor Corporation
- Peng-Cheng Lin
- G01 - MEASURING TESTING
Information Patent Grant
Stacked multi-chip modules and method of manufacturing
- Patent number 5,422,435
- Issue date Jun 6, 1995
- National Semiconductor Corporation
- Hem P. Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of placing a semiconductor with die collet having cavity wal...
- Patent number 5,415,331
- Issue date May 16, 1995
- National Semiconductor Corporation
- Peng-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die collet with cavity wall recess
- Patent number 5,348,316
- Issue date Sep 20, 1994
- National Semiconductor Corporation
- Peng-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reducing thermal cycling in a semiconductor p...
- Patent number 5,339,216
- Issue date Aug 16, 1994
- National Semiconductor Corporation
- Peng-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LASER ENCAPSULATION OF MULTIPLE DISSIMILAR DEVICES ON A SUBSTRATE
- Publication number 20140177188
- Publication date Jun 26, 2014
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Philip Jason Stephanou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL THIN SHIELD ON ELECTRICAL DEVICE
- Publication number 20130032385
- Publication date Feb 7, 2013
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Peng Cheng Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WRAPAROUND ASSEMBLY FOR COMBINATION TOUCH, HANDWRITING AND FINGERPR...
- Publication number 20120092350
- Publication date Apr 19, 2012
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Srinivasan Kodaganallur Ganapathi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flex Design and Attach Method for Reducing Display Panel Periphery
- Publication number 20110254758
- Publication date Oct 20, 2011
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Peng Cheng Lin
- G02 - OPTICS
Information Patent Application
GROOVE ON COVER PLATE OR SUBSTRATE
- Publication number 20090323170
- Publication date Dec 31, 2009
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Peng Cheng Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD OF PREVENTING DAMAGE TO METAL TRACES OF FLEXIBLE...
- Publication number 20090231816
- Publication date Sep 17, 2009
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Peng Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Peng Cheng Lin

Person

Patents Grantslast 30 patents

Wraparound assembly for combination touch, handwriting and fingerpr...

System and method of preventing damage to metal traces of flexible...

Computer module device and method

Device and method for reducing thermal cycling in a semiconductor p...

Electronic system circuit package directly supporting components on...

Stacked multi-chip modules and method of manufacturing

Stacked multi-chip modules and method of manufacturing

Electronic package for isolated circuits

Lead frame including an inductor or other such magnetic component

Stacked multi-chip modules and method of manufacturing

Method of placing a semiconductor with die collet having cavity wal...

Die collet with cavity wall recess

Device and method for reducing thermal cycling in a semiconductor p...

Patents Applicationslast 30 patents

LASER ENCAPSULATION OF MULTIPLE DISSIMILAR DEVICES ON A SUBSTRATE

METAL THIN SHIELD ON ELECTRICAL DEVICE

WRAPAROUND ASSEMBLY FOR COMBINATION TOUCH, HANDWRITING AND FINGERPR...

Flex Design and Attach Method for Reducing Display Panel Periphery

GROOVE ON COVER PLATE OR SUBSTRATE

SYSTEM AND METHOD OF PREVENTING DAMAGE TO METAL TRACES OF FLEXIBLE...