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Zhudong Township, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Fin isolation structure for FinFET and method of forming the same
Patent number
11,942,373
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chu-An Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fin isolation structure for FinFET and method of forming the same
Patent number
11,688,644
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chu-An Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical mechanical planarization tool
Patent number
11,679,469
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Michael Yen
B24 - GRINDING POLISHING
Information
Patent Grant
FinFET contacts and method forming same
Patent number
11,189,727
Issue date
Nov 30, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Peng-Chung Jangjian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fin isolation structure for FinFET and method of forming the same
Patent number
10,998,239
Issue date
May 4, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Chu-An Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fin isolation structure for FinFET and method of forming the same
Patent number
10,714,395
Issue date
Jul 14, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chu-An Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adaptive endpoint method for pad life effect on chemical mechanical...
Patent number
9,333,619
Issue date
May 10, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Chu-An Lee
B24 - GRINDING POLISHING
Information
Patent Grant
Adaptive endpoint method for pad life effect on chemical mechanical...
Patent number
8,367,429
Issue date
Feb 5, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Chu-An Lee
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
Chemical Mechanical Planarization Tool
Publication number
20230271298
Publication date
Aug 31, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Michael Yen
B24 - GRINDING POLISHING
Information
Patent Application
FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME
Publication number
20230274982
Publication date
Aug 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chu-An LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION AND METHOD FOR POLISHING AND INTEGRATED CIRCUIT
Publication number
20220017780
Publication date
Jan 20, 2022
Taiwan Semiconductor Manufacturing company Ltd.
JI CUI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLURRY COMPOSITION AND METHOD FOR POLISHING AND INTEGRATGED CIRCUIT
Publication number
20210371702
Publication date
Dec 2, 2021
Taiwan Semiconductor Manufacturing company Ltd.
JI CUI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME
Publication number
20210265222
Publication date
Aug 26, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chu-An LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHEMICAL MECHANICAL PLANARIZATION TOOL
Publication number
20210053180
Publication date
Feb 25, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Michael Yen
B24 - GRINDING POLISHING
Information
Patent Application
FINFET CONTACTS AND METHOD FORMING SAME
Publication number
20210057571
Publication date
Feb 25, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Peng-Chung Jangjian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME
Publication number
20200365588
Publication date
Nov 19, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Chu-An LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME
Publication number
20200091007
Publication date
Mar 19, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Chu-An LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADAPATIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICA...
Publication number
20130146224
Publication date
Jun 13, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Chu-An Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADAPTIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICAL...
Publication number
20120231555
Publication date
Sep 13, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Chu-An Lee
G05 - CONTROLLING REGULATING