Peng SHEN

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Tsukuba-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for storage and supply of F3NO-free FNO gases a...
- Patent number 12,106,940
- Issue date Oct 1, 2024
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Ayaka Nishiyama
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Chemistries for etching multi-stacked layers
- Patent number 11,075,084
- Issue date Jul 27, 2021
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Peng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for minimizing sidewall damage during low k etch processes
- Patent number 11,024,513
- Issue date Jun 1, 2021
- Air Liquide Electronics U.S. LP
- Chih-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemistries for TSV/MEMS/power device etching
- Patent number 10,720,335
- Issue date Jul 21, 2020
- American Air Liquide, Inc.
- Peng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiN selective etch to SiO2 with non-plasma dry process for 3D NAND...
- Patent number 10,529,581
- Issue date Jan 7, 2020
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Chih-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of minimizing plasma-induced sidewall damage during low K e...
- Patent number 10,347,498
- Issue date Jul 9, 2019
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Chih-yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemistries for TSV/MEMS/power device etching
- Patent number 10,103,031
- Issue date Oct 16, 2018
- L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Georges Claude
- Peng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemistries for TSV/MEMS/power device etching
- Patent number 9,892,932
- Issue date Feb 13, 2018
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Peng Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR STORAGE AND SUPPLY OF F3NO-FREE FNO GASES A...
- Publication number 20220208517
- Publication date Jun 30, 2022
- L'air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Ge...
- Ayaka NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR STORAGE AND SUPPLY OF F3NO-FREE FNO GASES A...
- Publication number 20200203127
- Publication date Jun 25, 2020
- L'Air Liquide, Societe Anonyme pour I'Etude et I'Exploitation des procedes Ge...
- Ayaka NISHIYAMA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
POROUS FILM SEALING METHOD AND POROUS FILM SEALING MATERIAL
- Publication number 20200010630
- Publication date Jan 9, 2020
- L'Air Liquide, Société Anonyme pour I'Etude et I'xpoloitation des Procédés Ge...
- Keiichiro URABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES
- Publication number 20190326126
- Publication date Oct 24, 2019
- L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Ge...
- Chih-Yu HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiN SELECTIVE ETCH TO SiO2 WITH NON-PLASMA DRY PROCESS FOR 3D NAND...
- Publication number 20190206696
- Publication date Jul 4, 2019
- L'air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Ge...
- Chih-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING
- Publication number 20180366336
- Publication date Dec 20, 2018
- American Air Liquide, Inc.
- Peng SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MINIMIZING PLASMA-INDUCED SIDEWALL DAMAGE DURING LOW K E...
- Publication number 20180211845
- Publication date Jul 26, 2018
- L'Air Liquide, Societe Anonyme pour I'Etude et I'Exploitation des procedes Ge...
- Chih-yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING
- Publication number 20180076046
- Publication date Mar 15, 2018
- American Air Liquide, Inc.
- Peng SHEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHEMISTRIES FOR ETCHING MULTI-STACKED LAYERS
- Publication number 20170365487
- Publication date Dec 21, 2017
- L'Air Liquide, Société Anonyme pour l'Etude et I'Exploitation des Procédés Ge...
- Peng SHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES
- Publication number 20170110336
- Publication date Apr 20, 2017
- L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Ge...
- Chih-yu HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING
- Publication number 20170103901
- Publication date Apr 13, 2017
- American Air Liquide, Inc.
- Peng SHEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Systems and methods for storage and supply of F3NO-free FNO gases a...

Chemistries for etching multi-stacked layers

Methods for minimizing sidewall damage during low k etch processes

Chemistries for TSV/MEMS/power device etching

SiN selective etch to SiO2 with non-plasma dry process for 3D NAND...

Methods of minimizing plasma-induced sidewall damage during low K e...

Chemistries for TSV/MEMS/power device etching

Chemistries for TSV/MEMS/power device etching

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR STORAGE AND SUPPLY OF F3NO-FREE FNO GASES A...

SYSTEMS AND METHODS FOR STORAGE AND SUPPLY OF F3NO-FREE FNO GASES A...

POROUS FILM SEALING METHOD AND POROUS FILM SEALING MATERIAL

METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES

SiN SELECTIVE ETCH TO SiO2 WITH NON-PLASMA DRY PROCESS FOR 3D NAND...

CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING

METHODS OF MINIMIZING PLASMA-INDUCED SIDEWALL DAMAGE DURING LOW K E...

CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING

CHEMISTRIES FOR ETCHING MULTI-STACKED LAYERS

METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES

CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING