Peng Soon LIM

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Clip frame semiconductor packages and methods of formation thereof
- Patent number 8,951,841
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Melissa Mei Ching Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination resistant device package having raised bond surface an...
- Patent number 8,736,042
- Issue date May 27, 2014
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination resistant device package having low moisture sensitivity
- Patent number 8,097,934
- Issue date Jan 17, 2012
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of packaging integrated circuits
- Patent number 8,030,138
- Issue date Oct 4, 2011
- National Semiconductor Corporation
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress cavity package
- Patent number 7,868,433
- Issue date Jan 11, 2011
- National Semiconductor Corporation
- Peng Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TO263 device package having low moisture sensitivity
- Patent number 7,838,980
- Issue date Nov 23, 2010
- National Semiconductor Corporation
- Yee Kim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe panel for power packages
- Patent number 7,763,958
- Issue date Jul 27, 2010
- National Semiconductor Corporation
- Peng Soon Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe panel
- Patent number 7,714,418
- Issue date May 11, 2010
- National Semiconductor Corporation
- Peng Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical leadless leadframe package
- Patent number 7,582,954
- Issue date Sep 1, 2009
- National Semiconductor Corporation
- Peng Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawn power package and method of fabricating same
- Patent number 7,470,978
- Issue date Dec 30, 2008
- National Semiconductor Corporation
- Eng Hwa Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawn power package
- Patent number 7,342,297
- Issue date Mar 11, 2008
- National Semiconductor Corporation
- Eng Hwa Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Clip Frame Semiconductor Packages and Methods of Formation Thereof
- Publication number 20130249067
- Publication date Sep 26, 2013
- INFINEON TECHNOLOGIES AG
- Melissa Mei Ching Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AN...
- Publication number 20120080781
- Publication date Apr 5, 2012
- National Semiconductor Corporation
- Felix C. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS CAVITY PACKAGE
- Publication number 20100052123
- Publication date Mar 4, 2010
- National Semiconductor Corporation
- Peng Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL LEADLESS LEADFRAME PACKAGE
- Publication number 20090212382
- Publication date Aug 27, 2009
- National Semiconductor Corporation
- Peng Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PANEL
- Publication number 20090026590
- Publication date Jan 29, 2009
- National Semiconductor Corporation
- Peng Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS

Peng Soon LIM

Person

Patents Grantslast 30 patents

Clip frame semiconductor packages and methods of formation thereof

Delamination resistant device package having raised bond surface an...

Delamination resistant device package having low moisture sensitivity

Methods and systems of packaging integrated circuits

Low stress cavity package

TO263 device package having low moisture sensitivity

Leadframe panel for power packages

Leadframe panel

Optical leadless leadframe package

Sawn power package and method of fabricating same

Sawn power package

Patents Applicationslast 30 patents

Clip Frame Semiconductor Packages and Methods of Formation Thereof

DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AN...

LOW STRESS CAVITY PACKAGE

OPTICAL LEADLESS LEADFRAME PACKAGE

LEADFRAME PANEL