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Peng Su
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Austin, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Mechanical integrity evaluation of low-k devices with bump shear
Patent number
7,622,309
Issue date
Nov 24, 2009
FREESCALE SEMICONDUCTOR, INC.
Peng Su
G01 - MEASURING TESTING
Information
Patent Grant
Solderable metal finish for integrated circuit package leads and me...
Patent number
7,215,014
Issue date
May 8, 2007
FREESCALE SEMICONDUCTOR, INC.
Peng Su
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Mechanical integrity evaluation of low-k devices with bump shear
Publication number
20060292711
Publication date
Dec 28, 2006
Peng Su
G01 - MEASURING TESTING
Information
Patent Application
Solderable metal finish for integrated circuit package leads and me...
Publication number
20060022313
Publication date
Feb 2, 2006
Peng Su
H01 - BASIC ELECTRIC ELEMENTS