Membership
Tour
Register
Log in
Peng Su
Follow
Person
San Jose, CA, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Apparatus, system, and method for utilizing package stiffeners to a...
Patent number
11,410,920
Issue date
Aug 9, 2022
Juniper Networks, Inc.
Peng Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for attaching an integrated circuit package to a...
Patent number
11,322,367
Issue date
May 3, 2022
Juniper Networks, Inc.
Peng Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus, system, and method for facilitating electrical continuit...
Patent number
11,228,125
Issue date
Jan 18, 2022
Juniper Networks, Inc.
Peng Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus, system, and method for mitigating warpage of integrated...
Patent number
10,943,874
Issue date
Mar 9, 2021
Juniper Networks, Inc.
Peng Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus, system, and method for precise heatsink alignment on cir...
Patent number
10,588,213
Issue date
Mar 10, 2020
Juniper Networks, Inc.
Peng Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus, system, and method for mitigating warpage of lidless int...
Patent number
10,242,941
Issue date
Mar 26, 2019
Juniper Networks, Inc.
Peng Su
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating a semiconductor package with integrated subst...
Patent number
8,623,707
Issue date
Jan 7, 2014
Cisco Technology, Inc.
Andrew V. Kearney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with integrated substrate thermal slug
Patent number
8,405,203
Issue date
Mar 26, 2013
Cisco Technology, Inc.
Andrew V. Kearney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package device having crack arrest feature and method of forming
Patent number
7,821,104
Issue date
Oct 26, 2010
FREESCALE SEMICONDUCTOR, INC.
Chu-Chung Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...
Publication number
20240266301
Publication date
Aug 8, 2024
Juniper Networks, Inc.
Gautam GANGULY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ENABLING REDUCTION IN SEMICONDUCTOR PACKAGE SIZE
Publication number
20240186266
Publication date
Jun 6, 2024
Juniper Networks, Inc.
Valery KUGEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER FOR A SEMICONDUCTOR PACKAGE
Publication number
20240170417
Publication date
May 23, 2024
Juniper Networks, Inc.
Omar AHMED
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE WITH CONDUCTIVE PADS AND CONDUCTIVE LAYERS
Publication number
20220312591
Publication date
Sep 29, 2022
Juniper Networks, Inc.
Peng SU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPARATUS, SYSTEM, AND METHOD FOR UTILIZING PACKAGE STIFFENERS TO A...
Publication number
20220115309
Publication date
Apr 14, 2022
Juniper Networks, Inc.
Peng Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS, SYSTEM, AND METHOD FOR PRECISE HEATSINK ALIGNMENT ON CIR...
Publication number
20190104607
Publication date
Apr 4, 2019
Juniper Networks, Inc.
Peng Su
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPARATUS, SYSTEM, AND METHOD FOR MITIGATING WARPAGE OF CIRCUIT BOA...
Publication number
20190099820
Publication date
Apr 4, 2019
Juniper Networks, Inc.
Peng Su
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG
Publication number
20130210196
Publication date
Aug 15, 2013
Cisco Technology, Inc.
Andrew V. Kearney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG
Publication number
20120063096
Publication date
Mar 15, 2012
Andrew V. Kearney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE DEVICE HAVING CRACK ARREST FEATURE AND METHOD OF FORMING
Publication number
20100052106
Publication date
Mar 4, 2010
Chu-Chung LEE
H01 - BASIC ELECTRIC ELEMENTS