Peng SUN

Person

Wuxi City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing fan out wafer level package
- Patent number 9,773,684
- Issue date Sep 26, 2017
- National Center for Advanced Packaging Co., Ltd.
- Hongjie Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240203865
- Publication date Jun 20, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Quanlong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20240186200
- Publication date Jun 6, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...
- Publication number 20240071873
- Publication date Feb 29, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...
- Publication number 20230091513
- Publication date Mar 23, 2023
- SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD FOR CHIP
- Publication number 20220115356
- Publication date Apr 14, 2022
- National Center for Advanced Packaging Co., Ltd.
- Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE
- Publication number 20160218020
- Publication date Jul 28, 2016
- National Center for Advanced Packaging Co., Ltd.
- Hongjie WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine Pitch stud POP Structure and Method
- Publication number 20150035147
- Publication date Feb 5, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Jiangang LU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of manufacturing fan out wafer level package

Patents Applicationslast 30 patents

CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR

SENSING CHIP PACKAGING STRUCTURE AND METHOD

PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...

WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...

FAN-OUT ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD FOR CHIP

METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE

Fine Pitch stud POP Structure and Method