Peng Sun

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Fanling, HK

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package with stacked modules with channels passing throu...
- Patent number 8,194,411
- Issue date Jun 5, 2012
- Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Chi Kuen Vincent Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method for through-silicon-via based 3D wafer stacking
- Patent number 8,030,208
- Issue date Oct 4, 2011
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Chi Kuen Vincent Leung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF
- Publication number 20100246141
- Publication date Sep 30, 2010
- Hong Kong Applied Science and Technology Research Institute Co. Ltd. (ASTRI)
- Chi Kuen Vincent Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING
- Publication number 20090294974
- Publication date Dec 3, 2009
- Chi Keun Vincent Leung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR