Pengbo Tian

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Power tube connection structure of power amplifier and power amplifier
- Patent number 10,426,036
- Issue date Sep 24, 2019
- Huawei Technologies Co., Ltd.
- Songlin Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power tube connection structure of power amplifier and power amplifier
- Patent number 10,165,687
- Issue date Dec 25, 2018
- Huawei Technologies Co., Ltd.
- Songlin Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for welding gold-silicon eutectic chip, and transistor
- Patent number 8,916,970
- Issue date Dec 23, 2014
- Huawei Technologies Co., Ltd.
- Lungang Yun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER TUBE CONNECTION STRUCTURE OF POWER AMPLIFIER AND POWER AMPLIFIER
- Publication number 20190223293
- Publication date Jul 18, 2019
- Huawei Technologies Co., Ltd
- Songlin LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER TUBE CONNECTION STRUCTURE OF POWER AMPLIFIER AND POWER AMPLIFIER
- Publication number 20170347457
- Publication date Nov 30, 2017
- Huawei Technologies Co., Ltd
- Songlin LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Welding Gold-Silicon Eutectic Chip, and Transistor
- Publication number 20140175641
- Publication date Jun 26, 2014
- Huawei Technologies Co., Ltd
- Lungang Yun
- H01 - BASIC ELECTRIC ELEMENTS