Penglin Mei

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with heat spreader
- Patent number 9,484,289
- Issue date Nov 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress relief and heat spreader
- Patent number 9,196,576
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame based semiconductor device with routing substrate
- Patent number 8,980,690
- Issue date Mar 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Penglin Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integral heat sink
- Patent number 8,901,722
- Issue date Dec 2, 2014
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER
- Publication number 20150108625
- Publication date Apr 23, 2015
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER
- Publication number 20150084169
- Publication date Mar 26, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRAL HEAT SINK
- Publication number 20140239476
- Publication date Aug 28, 2014
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20130020689
- Publication date Jan 24, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Penglin Mei
- H01 - BASIC ELECTRIC ELEMENTS