Perceval Coudrain

Person

Grenoble, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip with bifunctional routing and associated method of manufacturing
- Patent number 11,823,997
- Issue date Nov 21, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a cooling circuit on an integrated circuit...
- Patent number 11,152,281
- Issue date Oct 19, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-transferring and electrically connecting device and electronic...
- Patent number 10,480,833
- Issue date Nov 19, 2019
- STMicroelectronics (Crolles 2) SAS
- Rafael Augusto Prieto Herrera
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device provided with a thermal dissipation member
- Patent number 9,997,431
- Issue date Jun 12, 2018
- STMicroelectronics (Crolles 2) SAS
- Rafael Augusto Prieto Herrera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for collective (wafer-scale) fabrication of electronic devic...
- Patent number 9,870,947
- Issue date Jan 16, 2018
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a microfluidic circuit within a three-dimensi...
- Patent number 9,646,914
- Issue date May 9, 2017
- STMicroelectronics S.A.
- Pierre Bar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a conducting contact on a conducting element
- Patent number 9,224,708
- Issue date Dec 29, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Philippe Colonna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for assembling two parts of a circuit
- Patent number 8,828,797
- Issue date Sep 9, 2014
- STMicroelectronics S.A.
- Perceval Coudrain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising a device with a vertical mobile eleme...
- Patent number 8,766,381
- Issue date Jul 1, 2014
- STMicroelectronics S.A.
- Fabrice Casset
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming an integrated circuit level by sequential tridim...
- Patent number 8,486,817
- Issue date Jul 16, 2013
- STMicroelectronics S.A.
- Perceval Coudrain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk acoustic wave resonator disposed on a substrate having a burie...
- Patent number 8,456,258
- Issue date Jun 4, 2013
- STMicroelectronics S.A.
- Perceval Coudrain
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Assembly of two parts of an integrated electronic circuit
- Patent number 8,186,568
- Issue date May 29, 2012
- STMicroelectronics (Crolles 2) SAS
- Philippe Coronel
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit comprising mirrors buried at different depths
- Patent number 7,902,621
- Issue date Mar 8, 2011
- STMicroelectronics S.A.
- Perceval Coudrain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY TRANSMISSION FRONT-END MODULE AND ASSOCIATED MANUFA...
- Publication number 20240097721
- Publication date Mar 21, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Ayssar SERHAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VAPOR CHAMBER
- Publication number 20230132980
- Publication date May 4, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean-Philippe Colonna
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTEGRATED STRUCTURE WITH BIFUNCTIONAL ROUTING AND ASSEMBLY COMPRIS...
- Publication number 20220093500
- Publication date Mar 24, 2022
- Commissariat à L'énergie atomique et aux énergies alternatives,
- Candice THOMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WITH BIFUNCTIONAL ROUTING AND ASSOCIATED METHOD OF MANUFACTURING
- Publication number 20220093501
- Publication date Mar 24, 2022
- Commissariat à L'énergie atomique et aux énergies alternatives,
- Candice THOMAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A COOLING CIRCUIT
- Publication number 20200144152
- Publication date May 7, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Louis-Michel COLLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-TRANSFERRING AND ELECTRICALLY CONNECTING DEVICE AND ELECTRONIC...
- Publication number 20180142923
- Publication date May 24, 2018
- STMicroelectronics (Crolles 2) SAS
- Rafael Augusto Prieto Herrera
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD FOR COLLECTIVE (WAFER-SCALE) FABRICATION OF ELECTRONIC DEVIC...
- Publication number 20180005889
- Publication date Jan 4, 2018
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PROVIDED WITH A THERMAL DISSIPATION MEMBER
- Publication number 20170287806
- Publication date Oct 5, 2017
- STMicroelectronics (Crolles 2) SAS
- Rafael Augusto Prieto Herrera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING A MICROFLUIDIC CIRCUIT WITHIN A THREE-DIMENSI...
- Publication number 20160343638
- Publication date Nov 24, 2016
- STMicroelectronics S.A.
- Pierre Bar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CONDUCTING CONTACT ON A CONDUCTING ELEMENT
- Publication number 20150028488
- Publication date Jan 29, 2015
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Jean-Philippe COLONNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING A DEVICE WITH A VERTICAL MOBILE ELEME...
- Publication number 20120074527
- Publication date Mar 29, 2012
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Fabrice Casset
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR ASSEMBLING TWO PARTS OF A CIRCUIT
- Publication number 20120052629
- Publication date Mar 1, 2012
- STMicroelectronics S.A.
- Perceval Coudrain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN INTEGRATED CIRCUIT LEVEL BY SEQUENTIAL TRIDIM...
- Publication number 20100308411
- Publication date Dec 9, 2010
- STMicroelectronics S.A.
- Perceval Coudrain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR AND METHOD FOR MANUFACTURING SAID RESO...
- Publication number 20100295631
- Publication date Nov 25, 2010
- STMicroelectronics S.A.
- Perceval Coudrain
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED CIRCUIT COMPRISING MIRRORS BURIED AT DIFFERENT DEPTHS
- Publication number 20090256224
- Publication date Oct 15, 2009
- STMicroelectronics S.A.
- Perceval Coudrain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH AN IMPROVED SENSITIVITY
- Publication number 20090014764
- Publication date Jan 15, 2009
- STMicroelectronics S.A.
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF TWO PARTS OF AN INTEGRATED ELECTRONIC CIRCUIT
- Publication number 20080205027
- Publication date Aug 28, 2008
- STMicroelectronics (Crolles 2) SAS
- Philippe Coronel
- H01 - BASIC ELECTRIC ELEMENTS

Perceval Coudrain

Person

Patents Grantslast 30 patents

Chip with bifunctional routing and associated method of manufacturing

Method of manufacturing a cooling circuit on an integrated circuit...

Heat-transferring and electrically connecting device and electronic...

Electronic device provided with a thermal dissipation member

Method for collective (wafer-scale) fabrication of electronic devic...

Process for producing a microfluidic circuit within a three-dimensi...

Method for manufacturing a conducting contact on a conducting element

Process for assembling two parts of a circuit

Integrated circuit comprising a device with a vertical mobile eleme...

Method for forming an integrated circuit level by sequential tridim...

Bulk acoustic wave resonator disposed on a substrate having a burie...

Assembly of two parts of an integrated electronic circuit

Integrated circuit comprising mirrors buried at different depths

Patents Applicationslast 30 patents

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

RADIO FREQUENCY TRANSMISSION FRONT-END MODULE AND ASSOCIATED MANUFA...

VAPOR CHAMBER

INTEGRATED STRUCTURE WITH BIFUNCTIONAL ROUTING AND ASSEMBLY COMPRIS...

CHIP WITH BIFUNCTIONAL ROUTING AND ASSOCIATED METHOD OF MANUFACTURING

METHOD OF MANUFACTURING A COOLING CIRCUIT

HEAT-TRANSFERRING AND ELECTRICALLY CONNECTING DEVICE AND ELECTRONIC...

METHOD FOR COLLECTIVE (WAFER-SCALE) FABRICATION OF ELECTRONIC DEVIC...

ELECTRONIC DEVICE PROVIDED WITH A THERMAL DISSIPATION MEMBER

PROCESS FOR PRODUCING A MICROFLUIDIC CIRCUIT WITHIN A THREE-DIMENSI...

METHOD FOR MANUFACTURING A CONDUCTING CONTACT ON A CONDUCTING ELEMENT

INTEGRATED CIRCUIT COMPRISING A DEVICE WITH A VERTICAL MOBILE ELEME...

PROCESS FOR ASSEMBLING TWO PARTS OF A CIRCUIT

METHOD FOR FORMING AN INTEGRATED CIRCUIT LEVEL BY SEQUENTIAL TRIDIM...

BULK ACOUSTIC WAVE RESONATOR AND METHOD FOR MANUFACTURING SAID RESO...

INTEGRATED CIRCUIT COMPRISING MIRRORS BURIED AT DIFFERENT DEPTHS

IMAGE SENSOR WITH AN IMPROVED SENSITIVITY

ASSEMBLY OF TWO PARTS OF AN INTEGRATED ELECTRONIC CIRCUIT